80 Channel 50GHz Flat Type AAWG WDM

What are the common WDM devices?

1. Optical fiber fusion taper WDM device
The optical fiber fusion taper device draws multiple optical fibers into a tapered shape under thermal fusion conditions, and slightly twists them to fuse them together, through the evanescent wave coupling in the tapered area to reach the coupling optical power required by their respective wavelengths. This kind of device does not need a wavelength selective device, is very simple, and is easy to mass produce. Its biggest advantage is low insertion loss, up to 0.05dB. In addition, it also has a good optical channel bandwidth/channel spacing ratio and temperature stability, can get a higher isolation ratio, and the manufacturing cost is relatively low. The disadvantage is that the size is slightly larger and the number of wavelength division multiplexing channels is less (less than 10).
2. Thin film filter type WDM device
Thin-film filter-type devices are usually composed of ten or twenty layers of dielectric films of different materials, refractive indexes and thicknesses according to the design requirements, and achieve the synthesis and separation of different wavelengths by forming passbands and stop bands for different wavelengths. The advantages of this device are compact structure, almost independent of fiber parameters, flat signal passband, low insertion loss, up to 0.4dB. The disadvantage is that the design and manufacture are more troublesome, the output is lower, and the price is higher than that of the melt cone type device.

Athermal AWG WDM, also known as Athermal Arrayed Waveguide Grating WDM and AAWG WDM Splitter, along with FBT WDM splitter, LAN WDM splitter, Filter WDM splitter, dense WDM splitter and coarse WDM splitter, are the most commonly used WDM device in construction of PON.

Product Information:

AAWG flat type no-heat module, which is based on Silicon PLC optical grating technology, is dense wavelength division multiplexing, using athermal configuration, no need to control the temperature of chip, with low insertion loss, high capacity, stable reliability.

Product Features:

• No need circuitry to control temperature
• High number of channels
• High Stability and reliability
• High isolation，low insertion loss

Product Specification:

• Numbers of Channel: 80
• Pass band wavelength (nm): ITU standard
• Offset of Central wavelength (nm): ±0.04
• Spacing (GHz): 50
• 1 dB Bandwidth (nm): 0.18
• 3 dB Bandwidth (nm): 0.28
• Insertion Loss (dB): Maximum 6.7
• Flatness (dB): Maximum 0.7
• Uniformity (dB) @ITU CW: Maximum 1.5
• Adjacent Channel Isolation (dB): Minimum 25
• Non-Adjacent, Channel Isolation (dB): Minimum 30
• Total Isolation (dB): Minimum 22
• Return Loss (dB) (with conn.): Minimum 45
• PDL (dB): Maximum 0.50
• PDM (ps): Maximum 0.50
• Operating Temperature Range (℃): -5~65
• Storage Temperature Range (℃): -40~85
• Fiber Type: Corning SMF 28e+ or equal（or customized）
• Fiber Length (m): ≥1.0（or customized）
• Package dimension (mm) Max: 150x70x12 or customized

Product Applications:

• DWDM Networks
• Channel add/drop
• Wavelength routing
• Fiber optical amplifier
• CATV optical system