IC Package Substrate

What is IC packaging made of? 

IC packaging refers to connecting the circuit pins on the silicon chip to external connectors with wires for connection with other devices.

The package form refers to a housing for mounting a semiconductor integrated circuit chip. It not only plays the role of mounting, fixing, sealing, protecting the chip and enhancing the electrical and thermal performance, but also connected to the pins of the package shell with wires through the contacts on the chip, and these pins pass through the wires on the printed circuit board. Connect with other devices, so as to realize the connection between the internal chip and the external circuit.

Because the chip must be isolated from the outside world, in order to prevent the corrosion of the chip circuit caused by the impurities in the air, the electrical performance is degraded.