Huaswin Electronics Company Group
Huaswin Electronics Company Group
Touch Screen Circuit Board Assembly Lead Free PCB with HAL
  • Touch Screen Circuit Board Assembly Lead Free PCB with HAL
Touch Screen Circuit Board Assembly Lead Free PCB with HAL
Touch Screen Circuit Board Assembly Lead Free PCB with HAL
Touch Screen Circuit Board Assembly Lead Free PCB with HAL

Touch Screen Circuit Board Assembly Lead Free PCB with HAL

Min. Order:
1
Min. Order:
1
Delivery Time:
30 Days
Quantity:

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Basic Info
Basic Info
Place of Origin: China
Product Description
Product Description

Touch Screen Circuit Board Assembly Lead Free PCB with HAL Surface

Specifications

- Contract Manufacturing

- Engineering Services

- PCB Design & Assembly

- Product Design

- Prototyping

- Cable and Wire Assemblies

- Plastics and Molds

PCB capability and services:


1. Single-sided, double-sided & multi-layer PCB (up to 30 layers)

2. Flexible PCB (up to 10 layers)

3. Rigid-flex PCB (up to 8 layers)

4. CEM-1, CEM-3 FR-4, FR-4 High TG, Polyimide, Aluminum-based material.
5. HAL, HAL lead free, Immersion Gold/ Silver/Tin, Hard Gold, OSP surface treatment.
6. Printed Circuit Boards are 94V0 compliant, and adhere to IPC610 Class 2 international PCB standard.
7. Quantities range from prototype to volume production.
8. 100% E-Test

Detailed Specification of PCB Manufacturing

1

layer

1-30 layer

2

Material

CEM-1, CEM-3 FR-4, FR-4 High TG, Polyimide,

Aluminum-based material.

3

Board thickness

0.2mm-6mm

4

Max.finished board size

800*508mm

5

Min.drilled hole size

0.25mm

6

min.line width

0.075mm(3mil)

7

min.line spacing

0.075mm(3mil)

8

Surface finish

HAL, HAL Lead free,Immersion Gold/ Silver/Tin, Hard Gold,

OSP

9

Copper thickness

0.5-4.0oz

10

Solder mask color

green/black/white/red/blue/yellow

11

Inner packing

Vacuum packing,Plastic bag

12

Outer packing

standard carton packing

13

Hole tolerance

PTH:±0.076,NTPH:±0.05

14

Certificate

UL,ISO9001,ISO14001,ROHS,TS16949

15

Profiling punching

Routing,V-CUT,Beveling

Detailed Specification of Pcb Assembly

1

Type of Assembly

SMT and Thru-hole

2

Solder Type

Water Soluble Solder Paste,Leaded and Lead-Free

3

Components

Passives Down to 0201 Size

BGA and VFBGA

Leadless Chip Carries/CSP

Double-Sided SMT Assembly

Fine Pitch to 08 Mils

BGA Repair and Reball

Part Removal and Replacement-Same Day Service

3

Bare Board Size

Smallest:0.25x0.25 Inches

Largest:20x20 Inches

4

File Formats

Bill of Materials

Gerber Files

Pick-N-Place File(XYRS)

5

Type of Service

Turn-Key,Partial Turn-Key or Consignment

6

Component Packaging

Cut Tape

Tube

Reels

Loose Parts

7

Turn Time

15 to 20 days

8

Testing

AOI inspection

X-Ray inspection

In-Circuit testing

Functional test

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