HDI R-F Multi-Layer PCB with HASL Finishing

HDI
Item                                 Mass Production                    Prototype
HDI structure              1+N+1,1+1+N+1+1                   2+N+2
Buried hole              Filled                                       Filled 
 Aspect ratio              0.75:1                                       0.75:1
 Minimum laser hole              0.1mm(4mil)                                       0.1mm(4mil)
 Minimum laser pad              0.25mm(10mil)                                       0.25mm(10mil)
 Blind hole No filled              No filled
Rigid & Flex board              NO                                                           YES
 Press fit hole              YES                                                         YES
Control Depth drilling              YES                                       YES
Lead-free &Halogen-free         YES                    YES
 Immersion Gold              Ni:2-5μm Au:0.05-0.10μm                   Ni:3-6μm Au:0.075-0.15μm
Immersion Tin              0.6-1.2μm                                       0.6-1.2μm
 Immersion silver              0.2-0.6μm                                       0.3-0.6μm
 OSP                                  0.1-0.4μm                                       0.25-0.4μm
HASL (Sn-Pb&LF)             Pad:>3μm /Big Cu:>1μm                   Pad:>4μm Big Cu:>1.5μm
 Flash Gold Ni:3-6μm Au:0.01-0.05μm Ni:3-6μm Au:0.02-0.075μm