FR4 CCTV camera module rigid-flex pcb

What is mixed technology?

The technology used to assemble the PCB and its various components is called the mounting technology board component in the circuit. Depending on the application, cost, scale and other considerations, PCBA manufacturers use different kinds of mounting methods. Here are some of the most commonly used techniques:
Surface-Mount (SMT) &BGA Assembly:
Surface mount components (or surface mount technology, also known as SMT) is a method in which Electronic Components standing on the PCB are directly connected to the surface of the circuit board. The final circuit board is called a surface mount device (SMD). This technology was originally called "flat mounting".
Most electronic boards currently produced are manufactured using SMT. Because of its increased circuit density and ability to produce results on smaller circuit boards, it has replaced the more traditional through-hole technology (more on the next point). Generally, SMT uses solder to connect the components to the circuit board, but in some cases, adhesive spots can also be used on the second side to keep the components in the reflow oven.
Through-Hole Assembly:
Through-hole technology (also called "through-hole") is a mounting technology in which Electronic Components are inserted through holes built into the PCB and then soldered to the pads. Welding can be done manually or using a plug-in installation machine.
Through hole technology replaces the traditional point-to-point structure. As double-sided and multi-layer boards become more and more popular, through holes are becoming popular. It is used to connect the Electronic Components with the conductive layer to ensure the normal operation of the circuit board. These components are equipped with leads to connect to the other side of the through-hole board.
In contrast to the SMT method, through-hole technology provides PCBA Manufacturing with greater cohesion because the unit is placed through the circuit board itself.