HAODA ELECTRONIC CO.,LIMITED
HAODA ELECTRONIC CO.,LIMITED
The temperature resistance of the PCB
  • The temperature resistance of the PCB
  • The temperature resistance of the PCB
  • The temperature resistance of the PCB
The temperature resistance of the PCB
The temperature resistance of the PCB
The temperature resistance of the PCB

The temperature resistance of the PCB

  • $7.00
    ≥2 Piece/Pieces
Min. Order:
2 Piece/Pieces
Min. Order:
2 Piece/Pieces
Transportation:
Ocean, Air, Express, Land
Port:
shenzhen
Quantity:

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Basic Info
Basic Info
Payment Type: T/T,Paypal
Incoterm: FOB,EXW
Transportation: Ocean,Air,Express,Land
Port: shenzhen
Product Description
Product Description

What's the temperature resistance of the PCB?


In order to ensure the quality of PCB circuit boards, a temperature resistance test is required. The purpose is to prevent PCB circuit boards from exploding, blistering, delamination and other adverse reactions at excessively high temperatures, resulting in poor product quality or direct scrap. This is a need to pay attention The problem. So what is the temperature resistance of the PCB circuit board and how to do the heat resistance test?

What is the temperature resistance of the PCB circuit board

The temperature problem of the PCB circuit board is related to the temperature of the raw materials, solder paste, and surface parts. Generally, the PCB circuit board can withstand a temperature of up to 300 degrees for 5-10 seconds. It is 240 degrees.

PCB circuit board heat resistance test:

1. First, prepare PCB circuit board production board and tin furnace.

Sampling 10*10cm substrate (or laminated board, finished board) 5pcs (copper-containing substrate without blistering and delamination)

Substrate: 10cycle or more

Laminated board: LOWCTE15010cycle or more

HTg material: more than 10cycle

Normal material: above 5cycle

Finished board: LOWCTE1505cycle or more; HTg material or more 5cycle; Normal material or more 3cycle.

2. Set the tin furnace temperature to 288±5 degrees, and use contact temperature measurement to calibrate;

3. Dip the flux with a soft brush and apply it to the surface of the board, then use the crucible tongs to take the test board and immerse it in the tin furnace. After timing for 10 seconds, take it out and cool it to room temperature. Visually check if there is any bubbling and explosion of the board. This is 1 cycle. ;

4. If there is a problem of blistering and exploding board, immediately stop the immersion tin and analyze the initiation point f/m. If there is no problem, continue the cycle until the board explodes, with 20 times as the end point;

5. The blistering part needs to be sliced and analyzed, to understand the source of the detonation point, and to take pictures.

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