1.54 Inch Square LCD Display

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Basic Info

Payment Type:	T/T

Product Description

TFT stands for "thin-film transistor." LCD stands for "liquid crystal display." Both terms refer to the flat-panel display, or screen, of a computer monitor or television set. TFT displays are made using large sheets of transistors, each one of which is controlled independently. A TFT screen is an "active-matrix" screen where each pixel of the display is illuminated individually.A TFT display is sharper and brighter than a common LCD display. It refreshes more quickly than a regular LCD display and shows motion more smoothly.TFT displays use more electricity than regular LCD screens, so they not only cost more in the first place, but they are also more expensive to operate.

Model: 154021S0
Resolution: 240*240
Viewing angle: IPS
Color: 65K
Features: ultra-high brightness 1100cd/m2, full viewing angle, ultra-thin design with integrated backlight, low power consumption, square structure, etc.
Application areas: two-wheeled vehicle dashboard, smart wear, medical equipment, instrumentation, digital electronics, smart home, white goods, etc.

Model Number	154021S0
size	1.54	Inch
LCD Type	Normally black	--
Drive element	TFT active matrix	--
Number of pixels	240*3RGB(H)X240(V)	Dots
Pixel arrangement	RGB stripe	--
Pixel Pitch (W*H)	0.1115(H) *0.1115 (V)	mm
Active area	27.27(H) * 27.27(V)	mm
Model Number	TXW154005S0
LCM Mechanical Outline Size(WHT)	31.52 33.72 1.65	mm
Viewing direction	ALL O’CLOCK	-
LCM Driver IC	ST7789V	-
LCM interface	MCU 8 Bit Interface	-
Lcm pin n count	20
Backlight leds	3	pcs
Backlight current	20	ma
Backligh voltage	9.6	v
operating temperature	-20+70	℃
storage temperature	-30+80	℃
Lumens degrees	1100	Cd/㎡

1. Introduction

1.1 Scope of application

This specification applies to the LCD module that is supplied by Tian Xian Wei

Technology CO., LTD.

LCD specification: Dots 240xRGBx240.

As to basic specification of the driver IC, refer to the IC (ST7789V)

specification and data book.

All material & processing of the LCD module should be Lead Free.

1.2 TFT features:

Structure: TFT PANNEL+IC +FPC+BL;

IPS Type LCD

240dot-segment and 240 dot-common outputs;

65K Color can be selected by software;

White LED back light;

Mcu 8bit l interface

1.3 Applications:

2. LCM General specification

ITEM	Sandard value	Unit
LCD Type	Normally Black	--
Drive element	TFT active matrix	--
Number of pixels	240*3RGB(H)X240(V)	Dots
Pixel arrangement	RGB stripe	--
Pixel Pitch (W*H)	0.1155(W) × 0.1155(H)	mm
Active area	27.72(W) ×27.72 (H)	mm
Viewing direction	ALL O’CLOCK	-
TFT Driver IC	ST7789V
TFT interface	Mcu 8bit l interface	-
Module Size(WHT)	31.52(W) ×33.71(H) ×1.55(D)	mm
Approx. Weight	TBD	g

3.Absolute Maximum Rating

Characteristics	Symbol	Min.	Max.	Unit
LCM Operating Temperature	T_OPR	-20	+70	°C
LCM Storage Temperature	T_STG	-30	+80	°C
TP Operating Temperature & Humidity(20% ~ 90%RH)	T_OPR			°C
TP SStorage Temperature & Humidity(20% ~ 90%RH)	T_STG			°C
Humidity	RH	-	90	%

4.Electrical Characteristics

4.1 TFT DC Characteristics

Characteristics	Symbol	Min.	Typ.	Max.	Unit
Supply Voltage for I/O	VDDIO				V
Supply Voltage for(DC/DC)	VDD	2.5	2.8	3.6	V
Supply Voltage for(DC/DC)	AVDD				V
Supply Voltage for(DC/DC)	AVEE				V
Current Consumption	I_DD	-	TBD	-	mA
Current Consumption	I_DD-SLEEP		TBD		uA

4.2 Back-Light Unit Characeristics

The back-light system is an edge-lighting type with 3 white LEDs. The characteristics of the back-light are shown in the following tables.

Characteristics	Symbol	Min.	Type	Max.	Unit	Notes
Forward Voltage	V_F	8.5	9	10.5	V	-
Forward current	I_F	--	20	-	mA	-
Luminance(With LCD)	Lv	900	1000	1100	cd/m²	-
LED life time	N/A	----	30,000	--	Hr	Note 1

Note:

(1) The “LED life time” is defined as the module brightness decrease to 50% of original brightness at I_L=20mA/LED. The LED life time could be decreased if operating I_L is larger than 25mA/LED.

Backlight circuit diagram shown in below:

5. Module Function Description

Pin No.	Symbol	Description
1	LEDA	BACKLIGHT +
2	LEDK	BACKLIGHT-
3	GND	System Ground
4	VDD	POWER SUPPLY 2.4V ~ 3.3V
5	VDD	POWER SUPPLY 2.4V ~ 3.3V
6	GND	System Ground
7-14	DB7-DB0	MCU parallel interface data bus
15	RD	Read enable in 8080 MCU parallel interface.
16	WR	Write enable in MCU parallel interface
17	NC	NC
18	NC	NC
19	CS	Chip selection pin
20	RS	Display data/command selection pin
21	RESET	Hardware reset
22-27	NC	NC
28	GND	System Ground
29	NC	NC
30	GND	System Ground

6. Timing Characteristics

7.Optical Characteristics

Items		Symbol	Condition	Specifications			Unit	All left side data are based on TIAN XIAN WEI product reference only
Items		Symbol	Condition	Min.	Typ.	Max.	Unit
Contrast Ratio		CR		-	800	-	-
Response Time		TB_R_B + TB_F_B		-	30	-	ms
Response Time				-	-	-	ms
Chromaticity	Red	XB_R_B			/		-
	Red	YB_R_B			/		-
	Green	XB_G_B			/		-
	Green	YB_G_B			/		-
	Blue	XB_B_B			/		-
	Blue	YB_B_B			/		-
	White	XB_W_B		0.28	0.31	0.34	-
	White	YB_W_B		0.29	0.32	0.35	-
Viewing angle	Hor.	f1(3 o’clock)	Center CR≥10	-	80	-	deg.
	Hor.	f2(9 o’clock)		-	80	-
	Ver.	q2(12 o’clock)		-	80	-
	Ver.	q1(6 o’clock)		-	80	-
Uniformity					--		%

Note 1: Definition of Contrast Ratio (CR):

The contrast ratio can be calculated by the following expression.

Contrast Ratio (CR) = L63 / L0

L63: Luminance of gray level 63

L0: Luminance of gray level 0

CR = CR (10)

CR (X) is corresponding to the Contrast Ratio of the point X at Figure in Note 5.

Note 2: Definition of Response Time (TR, TF):

The above “Viewing Angle” is the measuring position with Largest Contrast Ratio; not for good

image quality. View Direction for good image quality is 6 O’clock. Module maker can increase

the “Viewing Angle” by applying Wide View Film.

Note 4: Measurement Set-Up:

The LCD module should be stabilized at a given temperature for 20 minutes to avoid abrupt

temperature change during measuring. In order to stabilize the luminance, the measurement

should be executed after lighting Backlight for 20 minutes in a windless room.

9. Packing Method(包装参考)

Packing material description（包装材料说明）

材料名称 name of the material	规格参数 specification parameter	用量(PCS) dosage	包装方法及要求 Packing method and requirements
吸塑盘 Blister tray	38028013*0.5mm	50	1.将合格产品放入吸塑盒内，每盘共放32pcs。 1. Put qualified products into the blister box with a total of 32pcs per plate. 2.每层吸塑盒上垫一张珍珠棉，然后将吸塑错盘叠加放。 Put one piece of pearl cotton on each layer of blister box, and then superimpose the blister tray. 3.每5盒吸塑盘加一个空保护盘，放入一个内箱纸箱内。 Add an empty protection plate to the 5 boxes of blister plates and put them into an inner carton. 4.将10个内箱包装好放入外箱内。 Pack 10 inner boxes into outer boxes. 5.填写好标签贴于外箱统一位置。 Fill in the label and stick it in the same position of the outer box. 6.尾数箱必须用纸箱同等规格的吸塑/纸格板/珍珠棉及其他填充物填充 The rest of the boxes must be made of the same specifications of plastic/cardboard/pearl cotton and other fillings.
珍珠棉 pearl wool	37027013.5mm	50
内箱纸箱 Inside the box carton	41030075mm	10
外箱纸箱 Carton carton	620430410mm	1
注意事项(Notes)： 1、装箱时要特别留意,避免短装、多装。 Pay special attention to packing, avoid short-loading and over-loading. 2、客户、品名、数量、生产日期不能写错。 Customer, product name, quantity and production date shall not be written wrong. 3、作业员必须戴手套作业。 Operators must wear gloves to work. 4﹑包装物料必须清洁干净，不能有杂物出现。 Packaging materials must be clean and free from sundries.

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