
Stencil and screen cleaning systems
- Payment Type:
- L/C, T/T
- Incoterm:
- FOB
- Delivery Time:
- 20 Days
- Transportation:
- Ocean, Land, Air
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Contact NowPlace of Origin: | China |
---|---|
Supply Ability: | Strong |
Payment Type: | L/C,T/T |
Incoterm: | FOB |
Transportation: | Ocean,Land,Air |
Stencil and Screen Cleaning
Product Description
When manufacturing electronic assemblies, solder pastes, SMT adhesives or thick film pastes are printed or applied using stencils, pump print stencils or screens. Since solder paste residues and remaining SMT adhesives on the stencil surface and in the apertures can lead to misprints and sometimes hardening, a manual or an automated cleaning process for stencil or screen cleaning is a must.
The main products of ROC: SMT Cleaning Machine, PSA oxygen / nitrogen generator, wafer cleaning equipment, PCBA Cleaning Machine, PCB Separator, SMT Spare Parts, Reflow / Wave Soldering Machine, SMT Nozzle, SMT Feeder etc. If there is any need, please contact us.
Technical parameters:
1. Cleaning max size:750mm(L) ×750mm(W) × 40mm(H)2.Cleaning fluid Capacity:60L(max)×2PCS
3.Cleaning Process flow:The stencil moves up and down, and eight spray rods spray high-pressure liquid (cleaning → wind cutting → rinse → wind cutting → dry).
4.Rinse method: spray, open or closed loop
5.Drying method: four air knife air cutting drying
6.Clean liquid for recycling and filtration,recycled filter 0.45um
7.Air supply:0.45Mpa~ 0.7Mpa
8.Air consumption:200-400L/Min
9. power supply :AC380V 50HZ 60A
10. net weight:≈450Kg
11.Vent size:Φ120mm(W)
13. The machine size:1000mm(L) ×1520mm(W) × 1950mm(H)
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