6 inch DIE SAW processing Wafer Frame Cassette

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Payment Type:: T/T

Min. Order:: 1 Others

Min. Order:: 1 Others

Port:: Shenzhen

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Basic Info

Place of Origin:	shenzhen
Payment Type:	T/T
Port:	Shenzhen

Product Description

DIE SAW processing technology is to cut and slice a complete wafer into a grain of grain, which is convenient for the next process. In the process of cutting the dicing, a carrier must be provided to carry out the storage of the cut wafer. The 6 inch DIE SAW processing wafer cassette can do this daunting task well.

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Wafer Frame Cassette