End Cover type Slotted Magazine
- Payment Type:
- T/T
- Min. Order:
- 1 Others
- Min. Order:
- 1 Others
- Port:
- Shenzhen
Quantity:
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Contact NowBasic Info
Basic Info
| Place of Origin: | shenzhen |
|---|---|
| Payment Type: | T/T |
| Port: | Shenzhen |
Product Description
Product Description
During the semiconductor package test production process, a chip frame is required to be baked. The chip frame must be loaded with a carrier and placed in an oven for baking. At this time, it is required that the carrier must be hollowed on all four sides, and the product can be evenly baked and heated, and the baking speed can be faster and the effect can be better.
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