
High Power LEDs 3W UV/Ultraviolet 370nm Emitter
- Min. Order:
- 500 Piece/Pieces
- Min. Order:
- 500 Piece/Pieces
- Transportation:
- Ocean, Land, Air
- Port:
- SHENZHEN
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Contact NowPlace of Origin: | China |
---|---|
Productivity: | 1000000000 pcs/week |
Supply Ability: | 7000000000 pcs/week |
Payment Type: | T/T,Paypal |
Incoterm: | FOB,EXW,FCA |
Certificate: | GB/T19001-2008/ISO9001:2008 |
HS Code: | 8541401000 |
Transportation: | Ocean,Land,Air |
Port: | SHENZHEN |
Can LED Lights be used as UV?
Long ago, people will think it's a halogen lamps when we talk about the UV light. But now, UV Lamp can also be LED type no matter is small power or high power. In 2835 SMD LED case, 5050 SMD LED case or 5730 SMD LED case, we can produce is with small power such as 0.2W, 006W or even 0.5W or 1W. But in this high power case, we can make this UV LED be high power LED, which can sure it can work well in even 700mA operation current. On the other hand, there also have a dome lens on the top of SMD LED, that will increase the chip brightness.
UV High Power SMD LED Size:
Electrical Parameters:
Parameter |
Symbol |
Rating |
Unit |
Reverse Voltage |
VR |
5 |
V |
Junction Temperature |
Tj |
100 |
℃ |
Operating Temperature |
Topr |
-40 - +80 |
℃ |
Storage Temperature |
Tstg |
-40 - +100 |
℃ |
Soldering Temperature |
Tsol |
≤220 |
℃ |
Electro-Stati-Discharge(HBM) |
ESD |
1000 |
V |
Service lige under normal conditions |
Time |
60000 |
H |
Warranty |
Time |
2 |
Years |
Antistatic bag |
Piece |
500 |
Bag |
*Pulse forward current confition: Duty 1% and Pulse width=10us.
*Soldering confition: Soldering confition must be completed with 3 secongds at 260℃
Parameter |
Symbol |
Rating |
Unit |
Forward Current |
IF | 700 | mA |
Forward Voltage |
V | 3.4-4.0V | V |
Luminous Intensity |
IV | 10-20 | lm |
Wavelength |
λP |
370nm | nm |
Packing |
Piece | 1000 | reel |
Vewing angle |
2θ1/2 |
120 | Deg |
*Luminous intensity is measured by ZWL600.
*λD is derived from the CIE chromaticity diagram and represents the single wavelength which defines the color of the device.
Production of SMD Emitting LED:
HANDLING PRECAUTIONS:
Compare to epoxy encapsulant that is hard and brittle, silicone is softer and flexible Althouth its characteristiec significantly reduces thermal stress, it is more susceptible to damage by extemal mechanical force. As a result, special handling precautions need to be observed during assembly using silicone encapsulated Led products. Failure to comply might lead to damage and premature failure of the led
1. Handle the component along the side surfaces by using forceps or appropriate tools.

2, Do not directly touch or handle the silicone lens surface. It may damage the internal circuitry.

3, Do not stack together assembled PCBS containing exposed LEDs. Impact may scratch the silicone lens or damage the internal circuitry.

4, 4-A The inner diameter of the SMD pickup nozzle should not exceed the size of the LED to prevent air leaks;
4-B A plible material is suggested for the nozzle tip to avoid acratching or damaging the LED surface during pickup.
4-C The dimension of the component must be accurately programmed in the pick-and-place machine to insure precise pickup and avoid damage during production;
4-D As silicone encapsulation is permeable to gases, some corrosive substances such as H2S might corrode silver plationg of leadframe. Special care should be taken if an LED with silicone encapsulation is to used near such substances.

5, Please aviod continued exposure to the condensing moisture environment and keep the product away from repid transitions in ambiemt temperature.
6, Product in the original sealed package is recommended to be assembled within 24 hours of opening.

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