740nm High Power LEDs 1A 2835 SMD LED

High Power SMD LED with 2835 SMD LED case;

Normally we will just produce this 740nm LED as small chip inside, then those LED can handle opperation like 100mA. If we need more radiation, we have to drive it with much more power. But high power will burn the small chip. In this case, we produce this 2835FIRC74L42I1A with a big LED chip inside the 2835 SMD LED case. From the picture you can see, there are a small black square in the middle of SMD LED, that's the LED chip. The bigger chip side, the higher power the LED can reach. With this big chip inside, this 740nm LED can handle like 1000mA current. 

2835 SMD LED Size: 

*This SMD LED case are also available in UV LED, Red SMD LED ect*

Electrical Parameters:

*Pulse forward current confition: Duty 1% and Pulse width=10us.

*Soldering confition: Soldering confition must be completed with 3 secongds at 260℃

*Luminous intensity is measured by ZWL600.

*λD is derived from the CIE chromaticity diagram and represents the single wavelength which defines the color of the device.

Production of SMD LED 2835LED:

HANDLING PRECAUTIONS:

Compare to epoxy encapsulant that is hard and brittle, silicone is softer and flexible Althouth its characteristiec significantly reduces thermal stress, it is more susceptible to damage by extemal mechanical force. As a result, special handling precautions need to be observed during assembly using silicone encapsulated Led products. Failure to comply might lead to damage and premature failure of the led

1. Handle the component along the side surfaces by using forceps or appropriate tools.

2, Do not directly touch or handle the silicone lens surface. It may damage the internal circuitry.

3, Do not stack together assembled PCBS containing exposed LEDs. Impact may scratch the silicone lens or damage the internal circuitry.

4, 4-A The inner diameter of the SMD pickup nozzle should not exceed the size of the LED to prevent air leaks;

    4-B A plible material is suggested for the nozzle tip to avoid acratching or damaging the LED surface during pickup.

    4-C The dimension of the component must be accurately programmed in the pick-and-place machine to insure precise pickup and avoid damage during production;

    4-D As silicone encapsulation is permeable to gases, some corrosive substances such as H2S might corrode silver plationg of leadframe. Special care should be taken if an LED with silicone encapsulation is to used near such substances.

5, Please aviod continued exposure to the condensing moisture environment and keep the product away from repid transitions in ambiemt temperature.

6, Product in the original sealed package is recommended to be assembled within 24 hours of opening.