980nm 3W SMD 2835 IR High Power LED

980nm LED High Power IR LED

2835 SMD LED and 3528 SMD LED have a similar name and size of LED frame. But there will have kinds different, such as 2835 LED will have thinner size like 0.8mm and 3528 SMD LED will have 1.9mm normally. The biggest difference is that there have a heat sink on the bottom of 2835 LED, but there just two soldering pad on the 3528 LED. As we know LED will produce a lots of heat when it's working. The heat might reduce the lifespan of SMD LED. Then things will be better if there have a heat sink on the bottom of SMD LED. In this case, we will be able to put a bigger LED chip inside of 2835 LED and don't need worry that much about the heating issue. 2835FIRC98L42I1A are the 3w 980nm LED, which can handle 1000mA. If you need more detail about it, just contact us for more~

High power LED 2835 SMD LED Size: 

* High power SMD LED are also available in 940nm LED, 850nm LED, 730nm LED and some far red infrared LED *

Electrical Parameters:

*Pulse forward current confition: Duty 1% and Pulse width=10us.

*Soldering confition: Soldering confition must be completed with 3 secongds at 260℃

*Luminous intensity is measured by ZWL600.

*λD is derived from the CIE chromaticity diagram and represents the single wavelength which defines the color of the device.

Production of SMD LED 2835 LED:

HANDLING PRECAUTIONS:

Compare to epoxy encapsulant that is hard and brittle, silicone is softer and flexible Althouth its characteristiec significantly reduces thermal stress, it is more susceptible to damage by extemal mechanical force. As a result, special handling precautions need to be observed during assembly using silicone encapsulated Led products. Failure to comply might lead to damage and premature failure of the led

1. Handle the component along the side surfaces by using forceps or appropriate tools.

2, Do not directly touch or handle the silicone lens surface. It may damage the internal circuitry.

3, Do not stack together assembled PCBS containing exposed LEDs. Impact may scratch the silicone lens or damage the internal circuitry.

4, 4-A The inner diameter of the SMD pickup nozzle should not exceed the size of the LED to prevent air leaks;

    4-B A plible material is suggested for the nozzle tip to avoid acratching or damaging the LED surface during pickup.

    4-C The dimension of the component must be accurately programmed in the pick-and-place machine to insure precise pickup and avoid damage during production;

    4-D As silicone encapsulation is permeable to gases, some corrosive substances such as H2S might corrode silver plationg of leadframe. Special care should be taken if an LED with silicone encapsulation is to used near such substances.

5, Please aviod continued exposure to the condensing moisture environment and keep the product away from repid transitions in ambiemt temperature.

6, Product in the original sealed package is recommended to be assembled within 24 hours of opening.