ENIG finished circuit board

10-Layer Binding gold multilayer circuit board. Base material FR4(KB6167, tg170). Surface treatment immersion gold 5U". Binding location design requirements. Green colour soldermask circuit board.
The advantages of multilayer circuit boards: high assembly density, small size, and light weight. Due to the high assembly density, the connection between components (including components) is reduced, thereby increasing reliability; the number of wiring layers can be increased, thereby increasing the design flexibility; forming a circuit with a certain impedance; forming a high-speed transmission Circuit; can set the circuit, magnetic shield layer, but also set the metal core heat dissipation layer to meet the special needs of shielding, heat and other functional needs; simple installation, high reliability.