Multilayer ENIG circuit board

14 layer Multilayer rigid ENIG board. Surface treatment ENIG 4U", NI 118-236U". Matt black slodermask and white silkscreen. Inner copper 1 oz and outer copper finished 1.0 oz. board thickness 2.0 mm +/-10%.  Design with 50+/-5 ohms single end impedance and 100+/-10% ohms differential impedance.  4-up panel, cinnect with v-cut. No x-out allowed. min track/ min spacing 0.08/0.08mm.

Our General Capabilities: Can be 1-40 Layers rigid board and 1-12 layers flexible circuit board. Copper thickness can be: 1-10 oz Outer and 0.5-8 oz inner.

Surface treatment(surface finished) can be: HASL, Lead-free HASL, hard gold plating, Immersion Gold, Immersion Silver, Immersion Tin, OSP and the Options: Gold Tabs, Selective Au, Carbon Ink, Peelable Mask, Micro Via, Controlled Impedance, score, laser drill, blind Vias and buried Vias.

And the soldermask colour can be: green, bule, white,black, red, yellow, orange, matt-green(semi green), matt-black. The silkscreen colour can be: white, black, yellow.red.

Our Products are widely applied in Communications, Computer, Medical Instruments,Power supply, Digital, Industrial control, Scientific and Ducational research and development, automotive and other high-tech fields.