Hard gold finger board

8 layer Immersion Gold and hard gold edge connector board. Base Material is FR4 KB6167 (TG170). Copper thickness 1oz inner layer and 2oz finished outer layer.Board Thickness is 1.6mm and the Min.Hole Size is 0.20mm. Min.Line Width/Min.Line Spacing is 0.15mm/0.15mm. green solder-resist and with white silkscreen. AOI: 100%, E-test: 100%. Mixed surface treatment. Total Immersion gold 2-4U" and partial hard gold 30-50U". Gold finger boards are common.Including computer memory card, medical equipment and so on will be used.