Hot air solder level lead free

Double-side FR4 White soldermask circuit board. Surface treatment : Hot air solder level lead free. White slodermask. Outer copper finished 1.0 oz. board thickness 1.0 +/-0.1mm.  54-UP panel,connect with v-cut. No x-out. 100% E-test.

Hot air solder leveling is a step and process flow in PCB production process. Specifically, PCB board is immersed in a molten solder bath so that all exposed copper surfaces are covered by solder. Then remove excess solder from the PCB by using a hot air knife. Because the printed circuit board surface after soldering is the same material as the solder paste, the soldering strength and reliability are better.