Double-side FR4 immersion gold board. Surface treatment ENIG 2U", NI 118-236U". White slodermask and black silkscreen. Outer copper finished 1.0 oz. board thickness 0.8 +/-0.1mm. 10-up panel, connect with stamp holes. 100% E-test. No x-out allowed.
Our General Capabilities: Can be 1-40 Layers rigid board and 1-12 layers flexible circuit board. Copper thickness can be: 1-10 oz Outer and 0.5-8 oz inner.
Surface treatment(surface finished) can be: HASL, Lead-free HASL, hard gold plating, Immersion Gold, Immersion Silver, Immersion Tin, OSP and the Options: Gold Tabs, Selective Au, Carbon Ink, Peelable Mask, Micro Via, Controlled Impedance, score, laser drill, blind Vias and buried Vias.
And the soldermask colour can be: green, bule, white,black, red, yellow, orange, matt-green(semi green), matt-black. The silkscreen colour can be: white, black, yellow.red.
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