FR4 immersion gold binding board

4-Layer immersion gold binding board with red color soldermask. Use FR4 S1141(TG 140) material. Inner/outer copper thickness are both 1/1 OZ. Total board thickness is 1.6 mm. Min.hole size: 0.25 mm. 4-up with routed and score. 100% E-test. this board with binding pad need AU>3 U ". 

In Orilind's warehouse there are a lot of different thickness FR4 materials. From ordinary TG to high TG. For immersion gold board, we can make gold thickness 1-5U ".