Controlled deep milling circuit board

Controlled deep milling + Immersion Gold board. the base Material is FR4 IT180A (TG180). 10-layer PCB.Copper thickness is 1oz inner-layer/1.5oz outer-layer.Board Thickness is 2.0mm and the Min.Hole Size is 0.3mm. Min.Line Width/Min.Line Spacing is 0.15mm/0.15mm. green solder-resist & white silkscreen. E-test: 100%. Immersion gold is a common surface treatment, it has some advantages, such as smooth surface, easy welding, long shelf life and so on.