Printed Circuit Boards Electronic Assembly

       With a specialized focus on vertical electronic manufacturing services (EMS), Topscom provides assembly and build of electronic products. Our PCB assembly complies to strict quality requirements, including IPC standards.

•  01005 components, fine pitch and high count BGAs, Package on Package (POP), Chip on Board, fiber optics, RF microelectronics, press fit connectors
•  Hybrid processes (tin-lead and lead-free), pin through hole, wave & selective soldering, double and single sided reflow, wide body and backplanes
•  Quick turn prototype assembly, RoHS compliance certification, conformal & parylene coating, laser marking
•  Inspection and testing using the latest SPI, AOI, Flying probe and X-Ray equipment
•  Comprehensive electrical testing and test system development for boundary scan, in-circuit test (ICT), functional test and burn in test (BIT)
•  10 Lines High Speed Siemens SMT line,D4+D4+D1,which can meet high volume requirements.

Our Electronics Assembly operations are conducted within an organized and clean manufacturing environment, arranged in line with 5S lean-oriented organized workplace. Our facilities are ESD protected, air conditioned and humidity controlled. We have over 20 years of experience in production of printed circuit board assemblies (PCBA).

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General Overview & Capacity:
Production according to international standards
Workmanship standards in line with IPC-A-610 (Class 2 and 3)
Traceability level: based on Customer requirements
High-performance SMT lines: 950,0000 components per hour (cph)
Components placed in 2016: 7000 million (aprox. 3,5 million PCBAs)
Free capacity available and quick ability to increase capacity by 20%-30%
Software Control & Capabilities
Online SMT machine control: Feeder / Machine Slot / Reel validation, PPM level tracking (feeder / component / nozzle tracking), Automatically set Quality Alerts, Consumption level tracking
Traceability
Online Material Consumption reporting by component/reel
Production Management Systems
Quality Data (reporting, reflow profiles, AOI, SPI, Xray, test ) record system & historical data
Valor Vplan – defect-free NPI production
SMT production (technology)
Stencil Printing (3D inspection, Hawkeye)
Dispense technology (glue, paste)
Placement of 01005, BGA/CSP, QFP, uBGA
Pin-in-Paste technology
Reflow soldering in nitrogen atmoshpere
Inline AOI in each SMT line
THT production:
Radial/VCD automatic insertion and manual placement
Wave soldering in nitrogen atmosphere
Manual soldering
Depaneling (router, punch)
AOI inspection
PCB protection:
Advanced conformal coating (partial, angle)
Potting
Inspection:
SPI (Solder Paste Inspection)
X-Ray
Inline AOI for SMT
Offline AOI for THT
Test:
In-house test development (functional test, in-process verification tests)
In-circuit test (ICT)
Functional test
Safety tests (high voltage)
RoHS tests (X-ray fluorescence)
Burn-in (aging) test
Environmental tests