96% 99% alumina ceramic plunger ferrule tube bush

96% 99% alumina ceramic plunger ferrule tube bush

Reputation depends on quality,  quality comes from Hard!

Alumina Ceramics:

AlN has two very important properties worth noting: one is a high thermal conductivity and the other is a coefficient of expansion that matches Si. The disadvantage is that even a very thin oxide layer on the surface has an effect on the thermal conductivity. Only a strict control of the materials and processes can produce a uniform ARN substrate. AlN production technology is very small in China, such as Slyton. Compared with Al2O3, AlN price is relatively high, which is also a small bottleneck restricting its development. However, as the economy improves and technology upgrades, this bottleneck will eventually disappear.
Based on the above reasons, it can be known that alumina ceramics are widely used in microelectronics, power electronics, hybrid microelectronics, power modules and other fields due to their superior comprehensive performance. At present, there are five types of ceramic heat-dissipating substrates: HTCC, LTCC, DBC, DPC, and LAM. Among them, LAM belongs to the patented technology of Slyton and the National Optoelectronic Laboratory of Huazhong University of Science and Technology. HTCC\LTCC belongs to the sintering process, and the cost will be Higher.
DBC and DPC are professional technologies that have been developed and matured in recent years in China. DBC uses high temperature heating to combine Al2O3 with Cu plate. The technical bottleneck is that it is difficult to solve the problem of micropores between Al2O3 and Cu plates. This makes the mass production energy and yield of the product more challenging. The DPC technology uses the direct copper plating technology to deposit Cu on the Al2O3 substrate. The process combines materials and thin film process technology. The most commonly used ceramic heat sink substrate in recent years. However, its material control and process technology integration capabilities are relatively high, which makes the technical threshold for entering the DPC industry and stable production relatively high. LAM technology is also known as laser rapid activation metallization technology.

High hardness, high strength, wear resistance, corrosion resistance, high temperacture (1600°), good thermal diffusivity, good insulativity, low cost etc. 

Data Sheet↓

Thermal Shock Resistance: 200 △T°C

Maximum use temperature 1650°C

Dielectric Strength: ＞10 KV/mm

Dielectric Constant: 9.1er

Dielectric Loss Angle(1MHz): 0.0002-0.0003

Volume Resistivity(20°C): ＞1014Ω.cm

7.MOQ is not limited, small quantity is welcome.

8.Vigorous team and good after-sales service

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