ShenZhen VIP FIXPHONE Technology Co. Ltd
ShenZhen VIP FIXPHONE Technology Co. Ltd
PPD A8 A9 A10 Lower Upper BGA Reball Stencil Template For Iphone 6 6S 7
  • PPD A8 A9 A10 Lower Upper BGA Reball Stencil Template For Iphone 6 6S 7
PPD A8 A9 A10 Lower Upper BGA Reball Stencil Template For Iphone 6 6S 7

PPD A8 A9 A10 Lower Upper BGA Reball Stencil Template For Iphone 6 6S 7

  • USD15.99
    ≥1 Piece/Pieces
Payment Type:
T/T, D/P, Paypal, Money Gram, Western Union
Incoterm:
CIF, FCA, CPT
Min. Order:
1 Piece/Pieces
Min. Order:
1 Piece/Pieces
Delivery Time:
3 Days
Transportation:
Air
Port:
Shenzhen
Quantity:

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Basic Info
Basic Info
Place of Origin: shenzhen
Productivity: 9963
Supply Ability: 800000
Payment Type: T/T,D/P,Paypal,Money Gram,Western Union
Incoterm: CIF,FCA,CPT
Certificate: ISO999
HS Code: 1347890
Transportation: Air
Port: Shenzhen
Product Description
Product Description
PPD A8 A9 A10 CPU BGA Reballing Stencil Template, iPhone 6 Plus 6S Plus 7 Plus CPU NAND Flash BGA Stencil template, PPD iphone 64bit NAND / PCIE NAND Flash BGA Reballing Stencil and Sik tin network.

PPD A8 A9 A10 Lower Upper BGA Reball Stencil Template For iphone 6 Plus 6S Plus 7 Plus

[ Optional A8 A9 CPU Reball Stencil ]:
Optional 1: A8 lower
Optional 2: A8 upper
Optional 3: A8 Full set 

Optional 4: A9 lower
Optional 5: A9 upper
Optional 6: A9 Full set 

Optional 7: iPhone NAND 4-6P 
Optional 8: iPhone NAND 6S-7P (PCIE)

Optional 9:   A10 CPU lower
Optional 10:  A10 CPU upper
Optional 11:  A10 CPU Full Set 


Brand new PPD BGA Reballing Stencil for iPhone 6S 6 Plus 6S 6S plus,  A7 A8 A9 A10 CPU Ram Upper Lower Reball Tool Stencils Planted tin Mold



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