Special iPhone BGA Chip Remover Burin with 2pcs Handles 16pcs Blades

USD8.99

≥1 Piece/Pieces

Payment Type:: T/T, D/P, Paypal, Money Gram

Incoterm:: CFR, CIF

Min. Order:: 1 Piece/Pieces

Min. Order:: 1 Piece/Pieces

Delivery Time:: 3 Days

Transportation:: Air

Port:: Shenzhen

Quantity:

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Basic Info

Place of Origin:	shenzhen
Productivity:	200000
Supply Ability:	400000
Payment Type:	T/T,D/P,Paypal,Money Gram
Incoterm:	CFR,CIF
Certificate:	ISO999
HS Code:	1347890
Transportation:	Air
Port:	Shenzhen

Product Description

iPhone BGA chip Knife tool will remove IC chip from motherboard, with 16pcs Ultra Thin Blades and 2pcs Handles, This Special BGA Chip Remover Burin used for remove IC Chip CPU NAND from Phone mainboard, PCB Repair, operate convenient.

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Related Keywords

Special IPhone BGA Chip , IPhone BGA Chip Knife Tool Will Remove IC Chip , Remove IC Chip CPU NAND