Bingri Electronic Technology (Shenzhen) Co., Ltd.
Bingri Electronic Technology (Shenzhen) Co., Ltd.
3535 LED Luminous Lamp Beads, Super Bright
  • 3535 LED Luminous Lamp Beads, Super Bright
3535 LED Luminous Lamp Beads, Super Bright

3535 LED Luminous Lamp Beads, Super Bright

Transportation:
Air
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Basic Info
Basic Info
Place of Origin: China
Payment Type: T/T
Incoterm: FOB
Certificate: ISO9001;IATF16949
Transportation: Air
Product Description
Product Description

3535 LED Luminous Lamp Beads, Super Bright

We are the chip of the brand manufacturer, the chip of the lamp bead is just like the heart of the human body. Our chip has the characteristics of high brightness, strong anti-static ability, strong anti-fall ability, good consistency, and not easy to die. We have advanced equipment, high-efficiency work, fully automatic optical devices and image preview processing chips.                                                  



  • Features


       * Emitted Color: UVC 

        * Lens Appearance: Clean quartz lens

        * Dimensions:3.5*3.5mm 
        * Power
:25-30mW 
        * Optical Angle
:60 degree
        * Current
:150mA 
        * Voltage
:6.5V 
        * Wavelengths: 270-280nm 

  • Applications

        1.Sterilize



  • Soldering:



        1. Manual Soldering
        The temperature of the iron tip should not be higher than 350℃and Soldering time to be within 3 seconds per
        solder-pad.
        2. Reflow Soldering
        Preheating : 140℃~160℃±5℃,within 2 minutes.
        Operation heating : 260℃(Max.) within 10 seconds.(Max)

        Gradual Cooling (Avoid quenching)

huiliuhang



  • Storage



        In order to avoid the absorption of moisture, it is recommended to solder BINGRI LEDs as soon as possible after
        unpacking the sealed envelope.
        If the envelope is still packed, to store it in the environment as following:
          (1)Temperature : 5℃-30℃(41℉)Humidity : RH 60﹪Max.
          (2)After this bag is opened, devices that will be applied to infrared reflow, vapor-phase reflow, or equivalent
              soldering process must be:
              a. Completed within 168 hours.
              b. Stored at less than 30% RH.
        (3)Devices require baking before mounting, if:
             (2) a or (2) b is not met.
        (4)If baking is required, devices must be baked under below conditions:
               48 hours at 60℃±3℃





  • Tapping and packaging specifications (Units: mm)


Tapping and packaging specifications





* Widely used in surface sterilization,air sterilization,water sterilization,and has a high usage rate in biomedicine.


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