Bingri Electronic Technology (Shenzhen) Co., Ltd.
Bingri Electronic Technology (Shenzhen) Co., Ltd.
3535 Alumina Ceramic Substrate Lights High Power
  • 3535 Alumina Ceramic Substrate Lights High Power
  • 3535 Alumina Ceramic Substrate Lights High Power
  • 3535 Alumina Ceramic Substrate Lights High Power
  • 3535 Alumina Ceramic Substrate Lights High Power
3535 Alumina Ceramic Substrate Lights High Power
3535 Alumina Ceramic Substrate Lights High Power
3535 Alumina Ceramic Substrate Lights High Power
3535 Alumina Ceramic Substrate Lights High Power
3535 Alumina Ceramic Substrate Lights High Power
3535 Alumina Ceramic Substrate Lights High Power

3535 Alumina Ceramic Substrate Lights High Power

Transportation:
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Basic Info
Basic Info
Place of Origin: China
Payment Type: T/T
Incoterm: FOB
Certificate: ISO9001;IATF16949
Transportation: Air
Product Description
Product Description

                                         3535 Alumina Ceramic Substrate Lights High Power

We produce high-performance, high-reliability power LEDs, a variety of specifications are available, suitable for different scenarios, different currents, you can find what you need in our shop, or you can consult with us, we will best Service brought to you. We are a professional LED lamp bead looking for a lighting manufacturer, with a complete range of lamps and a reasonable price. We have strong strength, high credit, guarantee the quality of our products, and win the trust of our customers with our diversified operating characteristics and the principle of small profits but quick turnover.


  • Features

       * Emitted Color: UVC 

        * Lens Appearance: Clean quartz lens

        * Dimensions:3.5*3.5mm 
        * Power
:25-30mW 
        * Optical Angle
:60 degree
        * Current
:150mA 
        * Voltage
:6.5V 
        * Wavelengths: 270-280nm 

  • Applications

        1.Sterilize



  • Soldering:



        1. Manual Soldering
        The temperature of the iron tip should not be higher than 350℃and Soldering time to be within 3 seconds per
        solder-pad.
        2. Reflow Soldering
        Preheating : 140℃~160℃±5℃,within 2 minutes.
        Operation heating : 260℃(Max.) within 10 seconds.(Max)

        Gradual Cooling (Avoid quenching)

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  • Storage



        In order to avoid the absorption of moisture, it is recommended to solder BINGRI LEDs as soon as possible after
        unpacking the sealed envelope.
        If the envelope is still packed, to store it in the environment as following:
          (1)Temperature : 5℃-30℃(41℉)Humidity : RH 60﹪Max.
          (2)After this bag is opened, devices that will be applied to infrared reflow, vapor-phase reflow, or equivalent
              soldering process must be:
              a. Completed within 168 hours.
              b. Stored at less than 30% RH.
        (3)Devices require baking before mounting, if:
             (2) a or (2) b is not met.
        (4)If baking is required, devices must be baked under below conditions:
               48 hours at 60℃±3℃





  • Tapping and packaging specifications (Units: mm)


Tapping and packaging specifications





* Widely used in surface sterilization,air sterilization,water sterilization,and has a high usage rate in biomedicine.


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