Bingri Electronic Technology (Shenzhen) Co., Ltd.
Bingri Electronic Technology (Shenzhen) Co., Ltd.
3535 High Power LED Lamp Beads
  • 3535 High Power LED Lamp Beads
  • 3535 High Power LED Lamp Beads
  • 3535 High Power LED Lamp Beads
  • 3535 High Power LED Lamp Beads
3535 High Power LED Lamp Beads
3535 High Power LED Lamp Beads
3535 High Power LED Lamp Beads
3535 High Power LED Lamp Beads

3535 High Power LED Lamp Beads

Transportation:
Air
Quantity:

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Basic Info
Basic Info
Place of Origin: China
Payment Type: T/T
Incoterm: FOB
Certificate: ISO9001;IATF16949
Transportation: Air
Product Description
Product Description

                                            3535 High Power LED Lamp Beads

We are original authentic, 3535, high brightness and high CRI, professional chip, high efficiency and energy saving, lamp bead voltage 6.5V, suitable for LED lamps, automotive lighting, stage lighting, strong light flashlights and other places. Note that because high-power LEDs generate a lot of heat, a heat sink must be installed. The heat dissipation of the substrate itself is definitely not enough. If the heat dissipation measures are not done well, the lamp beads are prone to luminous decay and burning, so We also have ceramic substrates on sale.

  • Features


       * Emitted Color: UVC 

        * Lens Appearance: Clean quartz lens

        * Dimensions:3.5*3.5mm 
        * Power
:25-30mW 
        * Optical Angle
:60 degree
        * Current
:150mA 
        * Voltage
:6.5V 
        * Wavelengths: 270-280nm 

  • Applications

        1.Sterilize



  • Soldering:



        1. Manual Soldering
        The temperature of the iron tip should not be higher than 350℃and Soldering time to be within 3 seconds per
        solder-pad.
        2. Reflow Soldering
        Preheating : 140℃~160℃±5℃,within 2 minutes.
        Operation heating : 260℃(Max.) within 10 seconds.(Max)

        Gradual Cooling (Avoid quenching)

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  • Storage



        In order to avoid the absorption of moisture, it is recommended to solder BINGRI LEDs as soon as possible after
        unpacking the sealed envelope.
        If the envelope is still packed, to store it in the environment as following:
          (1)Temperature : 5℃-30℃(41℉)Humidity : RH 60﹪Max.
          (2)After this bag is opened, devices that will be applied to infrared reflow, vapor-phase reflow, or equivalent
              soldering process must be:
              a. Completed within 168 hours.
              b. Stored at less than 30% RH.
        (3)Devices require baking before mounting, if:
             (2) a or (2) b is not met.
        (4)If baking is required, devices must be baked under below conditions:
               48 hours at 60℃±3℃





  • Tapping and packaging specifications (Units: mm)


Tapping and packaging specifications





* Widely used in surface sterilization,air sterilization,water sterilization,and has a high usage rate in biomedicine.


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