Rigid-flex circuits Prototype

At Hemeixinpcb, we pride ourselves on taking on the most complex of design challenges. Rigid flex circuits can be designed to meet highly complex and unimaginable configurations while utilizing a rigid substrate. More often than not, the rigid component of a Rigid-flex circuits is utilized for high density device population. In addition, flexible circuits allow for minutely narrow lines giving way to high density device population. Denser device populations and lighter conductors can be designed into a product, freeing space for additional product features.

Consumers' escalating demand for more features in their small and mobile electronics products, such as PDAs and cell phones, is driving a need for smaller feature sizes, process geometries, and pc boards. For engineers dealing with these desires, the need for HDI (high-density-interconnect) technology has become a reality. HemeixinPCB describes HDI technology as a process that lets you produce a pc-board with through-hole, blind, or buried vias of less than 0.006 in. in diameter without using conventional drilling technology. Users of HDI technology must be able not only to assess and implement next-generation technology, but also to understand its boundaries in terms of layer stack up, via and microvia formation, feature size, and the primary differences between it and traditional pc-board technologies.