Hemeixin Electronics Co.,Ltd.
Hemeixin Electronics Co.,Ltd.
Mixed Dielectric PCB Prototype Fabrication
  • Mixed Dielectric PCB Prototype Fabrication
Mixed Dielectric PCB Prototype Fabrication

Mixed Dielectric PCB Prototype Fabrication

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Basic Info
Basic Info
Product Description
Product Description

Hemeixinpcb has established considerable technical knowledge and manufacturing experience in the supply of complex microwave PTFE and Multilayer Mixed Dielectric PCB. From simple multilayer structures through to complex metal-cored PCB, Hemeixinpcb can offer the complete solution.Hemeixinpcb has a policy of continuous investment and now boasts a capability that can meet the most demanding RF/Microwave requirements. Hemeixinpcb can offer blind and buried, plated through vias (THP), laser cut cavities, embedded resistors and connectors.

Mixed Dielectric PCB

We can offer:

Single or double-sided circuitry
Adhesive-based and adhesiveless constructions                   
Surface finishes include anti-tarnish, immersion silver,tin, solder, electroplated nickel/gold, and ENIG
Film stiffeners/ Polyimide Stiffeners
 EMI shielding
Stainless steel stiffeners
Aluminum Stiffeners
No MOQ/MOV prototype
Large format flexible circuit

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  • Ms. Nancy Zhang

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