hybrid Dielectric PCB Prototype Fabrication

The hybrid Dielectric PCB stack-up can be used as one of enablers to improve SI for signals routed on selected layers. For a hybrid PCB stack-up, some layers of the PCB use low loss dielectric while the others are fabricated with the traditional FR4. The cost of such a hybrid stack-up is normally lower than all low loss material PCB stack-up, but with the advantage of some routing layers having the same or similar low loss properties as an all low loss stack-up, thus achieving optimized cost-performance.