TOPVIEW ELECTRONICS CO.,LTD
TOPVIEW ELECTRONICS CO.,LTD
COG Bonding Machine
  • COG Bonding Machine
COG Bonding Machine

COG Bonding Machine

Payment Type:
T/T
Incoterm:
FOB
Transportation:
Ocean, Land, Air
Quantity:

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Basic Info
Basic Info
Place of Origin: china
Payment Type: T/T
Incoterm: FOB
Transportation: Ocean,Land,Air
Product Description
Product Description
1.The definition of COG bonding machine :
COG bonding equipment (pre-press) referred to as [bonding machine," [hot-press", COG bonding equipment is to determine the IC chip on top of LCD glass finishing and binding equipment, machine controlled by a PLC + HMI composition core products in the completion of the bits and transmitted by the platform after preloading pressure to bind the crimp. Using ACF (Anisotropic conductive adhesive) by pressing the IC bonding directly to the LCD screen. After bonding the entire module is also through FPC (flexible printed circuit board) metal pin and PCB board connector or together. LCD screen, ACF, the driver IC are the three key components of COG.

2.About the application field of COG bonding machine TVG97-A1:
 COG bonding equipment (preload) is widely used in a variety of LCD display (LCD), modules (LCM) and large-sized display panel production, assembly, maintenance, production enterprises; such as: mobile phones, laptops, LCD monitors, tablet PCs, LCD / LCM production, assembly, repair enterprises.

3.About the working principle of COG bonding machine TVG97-A1:
The working principle of COG bonding equipment (preload) is make the attached IC .ACF`s LCD.LCM assembled and bound in the (LCM) module production, maintenance and production process .using the head pressure, head temperature, bonding time, optical alignment system to make IC. LCD and LCM.ACF glue bound ,so that it can conduct.

4.Basic parameters of TVQ77-A1
 Input Power: AC220V 50-60HZ
 Vacuum control: vacuum + vacuum generator
 Dimensions: L1000 * W1050 * H1475mm (excluding warning lights)
 Operating modes: 7-inch HMI
 Platform Work: Fixed
 Platform Material: high quality Bakelite
 Control system (LG-LS): a programmable processor
 Pressure gauge: KITA, the number of explicit
 Pressure regulator: Japan SMC, precision pressure regulating valve
 Pressure accuracy: ± 0.5% full in the degree
 Sensitivity: 0.2% full in the degree
 Pressure Unit: Kg / N / Mpa / Kpa swap
 counterpoint mode: CCD next counterpoint
 Platform Work: Fixed
 Platform Material: high quality Bakelite
 Heating: heating thermostat
 Thermocouple: K type
 Blade material: 440C
 Temperature range: RT-500 ℃

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