8.5'' FOB/FOG TAB Bonding Machine

FOG/FOB Bonding Machine

1.Application:

This Machine is used to bonding FPC.COF.TAB and LCD Panel,PCB for the TP

LCD Panels.

2.Parameter

No. Item Spec. 
2.1 Panel&Glass Available Size:7-85inch 
2.2 FPC/COF/TAB 1)Thickness:0.1-1mm;

2)Length:5-60mm;

3)Pitch:≥0.01mm;
 

3. Equipment Performance

No. Item Spec. 
3.1 Technology Process 1) Put Panel on the platform,turn on Vacuum and absorb tightly ;

2)Turn on FPC Vacuum,,and absorb the FPC on Jig;

3)Turn Over FPC Jig,Manually Regulate X-Y-θ to locate;

4) Press Double-Start Button,Pressure Head heating,underdraught,Bonding.
 
3.2 Theory capacity 150-200Sec/Pcs 
3.3 Failure Rate ≤0.01% 

4. Equipment and unit Parameter

No. Item Spec. 
4.1 Demand Power AC220V  50-60Hz±10% 50HZ 3.0KW 
4.2  compressed air 1)windpipe color:Black;

2)windpipe diameter:￠8mm ;

3)working pressure: 0.4-0.8Mpa ;

4)Air Comsumption:≈50L/min;
 
4.3 Vacuum 1)Vacuum Control Mode:Vacuum Pump+Vacuum Generator

2) Vacuum Windpipe Color:Black;
 
4.4 Color Painted Surface Finished 
4.5 G.W In kind prevail 
4.6 Dimension The static size:L2220*W1750*H1590mm(Not including the alarm lamp)

Max size during working:

L3020*W1750*H1590mm
 
4.7 Control Unit 1)Touch Panel:7inch,Man-machine Interface ;

2)resolution ratio:1024×768;

3)Control System(LG-LS)

Program Processor;

4)Pressure Meter:KITA ,Digital Display Pressure Meter

5)Pressure Regulate:Japan SMC,Precision Pressure Regulating Valve ;

6)Pressure Precision:±0.5% in full;

7)Sensitivity:0.2% in full;

8)Pressure Unit:Kg/N/Mpa/Kpa swap ;
 
4.8 Operate Interface Unit Language:English/Chinese(Optional);

1)Parameter set interface:can set and display the parameter;

2)Auto Mode;

3)Manual Mode;

4)Abnormal Alarm;

5)Touch Panel Code(Optional);
 
4.9 Hot Pressure Head Unit 1)Heat Method:pulse heating;

2)Pressure Head Spec.:customize

3)Extrusion fixture: quartz

4)Thermocouple:"K" type;

5)Head Materials:titanium alloy,flatness:±4um;

6)Hot Press Time:0.1-999s,(0.1S as the setting unit);

7)Head Level Regulate Method:Manually;

8)Locating Regulate:X.Y.θMicrometer fine-tuning;

9)Temperature Range:RT-500℃;

10)Head Length:55X1.5MM(OEM)

11)Silicon Rape Holder:12mm Width(OEM)

12)Temperature difference: ±5℃

13)Cylinder Diameter mm:40￠