FOG/FOB Bonding Machine XCH71-A3

Application:

1. The machine is used for bonding variety of FPC, COF, TAB to LCD PANEL.TOUCH AENSOR and PCB.

2. Widely used in large-size LCD screen repair bonding, touch screen repair bonding production bonding and other fields.

Features:

1. The machine is adopted double guide rails and bearing guide in order to ensure up and down moving precision.

2. Group of micrometer adjustment with vacuum function enable bonding and absorbing synchronous working at the same time and save time.

3. Platform can move left and right along the guide rail, which is convenient for multi-position bonding on large-size glass.

4. Small size LED light designing is adopted group of X-Y-Z adjustment that avoids adjusting repeatedly when it works.

5. Removable rack is more convenient to convey.

6. Independent design of vacuum attaching group solves the problem of traditional platform that failed to attach.

Basic Parameters:

Input power: AC220V 50-60Hz±10%50Hz 1.5KW

Group of Pressure Head: Single pressure head and double cyclinders

Rated power: 1.0KW

LCD Platform: Glass, move by hand

Working pressure: 0.4-0.8 Mpa

Size of Pressure Head: 100*5mm (can be customized)

Method of heating: Constant/Pulse heating (optional)

Available size: within 65 inches (can be customized)

Visual system: Camera top/bottom alignment (optional), 7 inches display

Controlling program: Local PLC

Dimension: L2200*W1620*H1650mm

Construction of Machine: In Parts

Accessories:

Sensitive paper, Anisotropic Conductive Film, Silicone Rubber, ACF Remover, Dust-free cloth, Ethanol, Cotton Swabs

Tools:

Tweezers, COF Removing Machine, Cutter, Hot Air Gun