8 Layer Gold Plated PCB Multilayer Printed Circuit Boards Fabrication

8 Layer Gold Plated PCB Multilayer Printed Circuit Boards Fabrication

PCB information:

Material: FR4 3 core ,6 layers,fake 8 layers

Surface finish:Gold plated

Copper weight:2OZ

Color: Black and white silkscreen

Board size:6*6cm

Stack up layer information as follow:

NO.1

1 Signal 1 component side, microstrip trace layer

2 Signal 2 internal microstrip trace layer, better trace layer (X direction)

3 Ground

4 Signal 3 stripline routing layer, better trace layer (Y direction)

5 Signal 4 Stripline Layer

6 Power

7 Signal 5 Internal Microstrip Trace Layer

8 Signal 6 Microstrip Trace Layer

NO.2

1 Signal 1 component SIDE, microstrip trace layer, good trace layer

2 Ground layer, better electromagnetic wave absorption capacity

3 Signal 2 stripline routing layer, good routing layer

4 Power power layer, and the underlying stratum constitute excellent electromagnetic absorption

5 Ground layer

6 Signal 3 stripline routing layer, good routing layer

7 Power Formations with Large Power Supply Impedance

NO.3

This is not a good way to stack boards due to poor electromagnetic absorption capability and large power supply impedance. Structure as follows:

1 Signal 1 component side, microstrip trace layer

2 Signal 2 internal microstrip trace layer, better trace layer (X direction)

3 Ground

4 Signal 3 stripline routing layer, better trace layer (Y direction)

5 Signal 4 Stripline Layer

6 Power

7 Signal 5 Internal Microstrip Trace Layer

8 Signal 6 Microstrip Trace Layer

NO.4

It is a variant of the third stacking mode. Since the reference layer is added and the EMI performance is better, the characteristic impedance of each signal layer can be well controlled.

1 Signal 1 component side, microstrip trace layer, good trace layer

2 Ground formation, better electromagnetic wave absorption capacity

3 Signal 2 stripline routing layer, good routing layer

4 Power power layer, and the underlying stratum constitute excellent electromagnetic absorption

5 Ground

6 Signal 3 stripline routing layer, good routing layer

7 Power layer with Large Power Supply Impedance