desoldering rework station ZM-R5860

●3 independent control heaters

①  top and bottom heaters are hot-air heating, the third IR (preheating area 350x260mm) is infrared heating, temperature accuracy within ±3℃, the top and bottom heaters can setting 6 segments rising temperature and 6 segments activity temperature, can save 50 groups temperature curves for different BGA chips.

②  it can heat PCB board and bga chips at the same time. And the third IR heater can preheat the PCB board from bottom, to avoid PCB from deformation during repair process. The top and bottom heaters heat independently;

③  the power consumptions of the third IR heater can be adjusted, make PCB board heating evenly, avoid the PCB from deformation.

④  The external sensor can detect temperature precisely, analyze and calibrate the real temperature curve accurately at any time.

●multi-functional hommization system

①  Adopt Taiwan human-machine interface, High-precision K-type thermocouple with close-loop control, with PLC control , the temperature shown on the touch screen, top heater can be moved freely; bottom heater can be adjusted up and down.

② Adopted all kinds of BGA nozzles, with 360° rotation, easy for installation and replacement, customized is available;

③ There is BGA soldering support shelf to support PCB board;

④ Multi-functional PCB support shelf, can be moved along X axis,with rapid and easy PCB board positioning , suitable for all kind of PCB position;

⑤ powerful cross-flow fan cool the PCB board fast after desoldering and soldering, it can prevent the PCB board from deformation; with vacuum pump and external vacuum suction pen to pick up the chips conveniently.

●Superior safety functions