BGA221 SD Solution_11.5X13mm Perform,eMCP 221 test socket

The SD solution is designed for test, debug, validation, and programming of eMMC, eMCP devices

The SD solution provides a compact test solution for eMMC, eMCP devices used in applications such as handheld, mobile, and TV product development.

Test, debug, validation, and programming of eMMC, eMCP devices

Failure analysis / System and wafer test

Package and Chip qualification

Production prototype / Data recover

Feature:

Suitable for devices of Samsung, Hynix, Sandisk, Toshiba, Intel, Kingston etc eMMC and eMCP.

Support eMMC version: ≤eMMC5.0.

Support hot plug, eMMC can be directly connected to PC with SD card reader.

Realize reading, accessing and writting data for eMMC and eMCP devices

Specification:

Mechanical

Socket Body: PPS

Socket Lid: AL

Contact: Spring Probe

Operation Temperature: -40ºC to 120ºC

Life Span at Operating Travel:100K Cycles min.

Cycles Spring Force:27gf per Pin

Electrical

Current Rating (Continuous) : 2.59A

Self Inductance:1.57nH

Bandwidth -1dB:10GHz

DC Resistance: 42mohm