BGA169(eMMC) Reball Kit_12X18mm,IC Reballing, eMMC/NAND flash reballing, BGA Reballing Kit, eMMC rework
- Payment Type:
- T/T, Western Union, paypal
- Min. Order:
- 1 Piece/Pieces
- Min. Order:
- 1 Piece/Pieces
- Delivery Time:
- 5 Days
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Contact Now| Place of Origin: | China |
|---|---|
| Payment Type: | T/T,Western Union,paypal |
Aluminum alloy structure, lightweight and durable structure
Precision IC guide, accurate positioning.
Steel Dimensions: (80 x 80) mm, apply to BGA 169, size: 12X18mm.
The unique tin ball storage room design, no need to poure out excess solder ball every time, make production more efficiency.
For more other BGA Reballing Kit, please contact our sales man.
Sireda Technology also provides Rework Solution. We have much experience in BGA Reballing, especially in POP Reballing. High yield rate guaranteed.
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Related Keywords
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BGA169(eMMC) Reball Kit_12X16mm,eMMC Reballing,BGA153 reballing, BGA Repair, BGA Rework Platform, replace eMMC
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