BGA162(eMCP) Reball Kit_12X13.5mm, eMCP Repair, BGA162 rework, eMCP reballing Kit, BGA reball platform, mobile IC reball

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Basic Info

Place of Origin:	China
Payment Type:	T/T,Western Union,paypal

Product Description

Aluminum alloy structure, lightweight and durable structure

Precision IC guide, accurate positioning.

Steel Dimensions: (80 x 80) mm, apply to BGA 162, size: 12X13.5mm.

The unique tin ball storage room design, no need to poure out excess solder ball every time, make production more efficiency.

For more other BGA Reballing Kit, please contact our sales man.

Sireda Technology also provides Rework Solution. We have much experience in BGA Reballing, especially in POP Reballing. High yield rate guaranteed.

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