BGA153(eMMC) Reball Kit_11.5X13mm, eMMC Reballing, BGA Reballing

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Basic Info

Place of Origin:	China
Payment Type:	T/T,Western Union,paypal

Product Description

Aluminum alloy structure, lightweight and durable structure

Precision IC guide, accurate positioning.

Steel Dimensions: (80 x 80) mm, apply to BGA 153, size: 11.5X13mm.

The unique tin ball storage room design, no need to poure out excess solder ball every time, make production more efficiency.

For more other BGA Reballing Kit, please contact our sales man.

Sireda Technology also provides Rework Solution. We have much experience in BGA Reballing, especially in POP Reballing. High yield rate guaranteed.

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