BGA186(eMCP) Reball Kit_12X16mm,Mobile IC reball, eMCP reballing, BGA186 reballing, Chip reball kit

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Basic Info

Place of Origin:	China
Payment Type:	T/T,Western Union

Product Description

Aluminum alloy structure, lightweight and durable structure

Precision IC guide, accurate positioning.

Steel Dimensions: (80 x 80) mm, apply to BGA 186, size: 12x16mm.

The unique tin ball storage room design, no need to poure out excess solder ball every time, make production more efficiency.

For more other BGA Reballing Kit, please contact our sales man.

Sireda Technology also provides Rework Solution. We have much experience in BGA Reballing, especially in POP Reballing. High yield rate guaranted.

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