Specification

SPECIFICATIONS                                     Revision:      1.0 (1) Absolute Maximum Rating
Parameter	Symbol	Absolute Maximum Rating			Unit
Forward Current	IF	20			mA
Peak Forward Current	IFP	100			mA
Reverser Voltage	VR	5			V
Power Dissipation	PD	80			mw
Electrostatic Discharge	ESD	1000			V
Operating Temperature	TOP	-25℃  80℃			℃
Storage Temperature	TSTG	-5℃  45℃			℃
Lead Storage Temperature	TSOL	Max.260℃ FOR 5 SECONDS MAX
IMP Conditions:Pulse Width≤10mess and duty≤1/10 (2) Initial Electrical/Characteristics
Parameter	Symbol	Condition	Min	Avg		Max	Unit
Forward Voltage	VF	IF=20mA	2.8			3.0	v
Reverse Current	IR	VR=5v				10	μA
Viewing Angle	θ/2	IF=20mA		50			deg
Luminous Intensity	IV		6000			8000	mcd
Peak Wavelength	λp						nm
CRI	Ra		92			95	Ra
Luminous Flux	Φ		6.5			7.5	Lm/w
Spectrum bound	X		0.43			0.46	±0.015
	Y		0.41			0.44	±0.015
Color lukewarm	K			2800			K
2.TYPICAL INITIAL OPICAL/ELECTRICAL CHARACTERISTICS Please refer to Figures:In page3 3.OUTLINE DIMENSIONS AND MATERIALS Please refer to drawing:In page2 Material as follows:Resin Epoxy Lead frame:Ag plating copper ally

    Application      

Manufacturer:	LZ	Current:	20mA	CRI:	>95
Color temperature:	2800k,  5600k, 7000k	Shape Type:	Round / straw hat	Leg:	long / short
Voltage:	2.9 -3.0 /  3.0-3.1 / 3.1-3.2v	Lumen/w:	110-120lm/w	Lumen:	6.5-7.5lm
Colloid:	Clear	Power:	0.06w	Light loss:	<0.1% / 1kh
Life:	50,000h	Certificate:	RoHS, CE	Warranty:	5years

      Reliability Performance                         Page:         4                                                         Revision:        1.0 Test items And Result

Test classification	Test item	Test Standard	Test Duration	Sample Size	C/E
Life test	Room temperature DC operating life test	Ta=25℃±5℃ IF=20mA	1000 hrs	20pcs	0/1
Environment Test	Thermal Shock Test	-10℃±5℃  100℃±5℃ 5min.  10sec.  5min.	50cydes	20pcs	0/1
	Temperature Cycle Test	-40℃±5℃  85℃±5℃ 30min.  5sec.  30min.	50cydes	20pcs	0/1
	High Temperature & High humidity Test	Ta=85℃±5℃ RH=85%±0.5%RH	1000 hrs	20pcs	0/1
	High Temperature Storage	Ta=100℃±5℃	1000 hrs	20pcs	0/1
	Low Temperature Storage	Ta=55℃±5℃	1000 hrs	20pcs	0/1
Mechanical Test	Resistance to Soldering Heat	Ta=230℃±5℃	5 sec	20pcs	0/1
	Lead Integrity	Load 2.5N(0.25kgf) 0° ~  90°~   0°	3 times	20pcs	0/1

Typical Optical/Electrical Characteristics Curves (Ta=25℃ Unless Otherwise Noted)       Installation   1.Storage Under the storage conditions of 30℃ or less and humidity less than 60%RH, the LEDs can be storage for 3months. Storage in a sealed container with moisture absorbent material can prolong the storage time to a certain extent bad storage conditions may cause the lead frames to corrode or degradation of LED characteristics. It is recommended that the LEDs be used as soon as possible.   2. Static electricity Static electricity of surge voltage damages the LED .Damaged LED will show some unusual chrematistics such as the forward voltage becomes lower or the LED do not light at the low current even not light. All devices equipment and machinery must be properly grounded. At the same time, it is recommended that wrist Bands or anti-electrostatic gloves anti-electrostatic containers be used when dealing with the LED.   3. Design Consideration When designing a circuit, the current through each LED must not exceed the absolute maximum rating specified for each LED .In the meanwhile , resistors for protection should be applied otherwise slight voltage shift will cause big current change, bum out may happen.    Thermal Design is paramount important in because heat generation may result in the Characteristics decline, such as brightness decreased, Color changed and so on. Please consider the heat generation of the LED when making the system design.   4. Lead Forming Any lead forming must be done before soldering, not during or after soldering. When forming leads ,the leads should bent at a point at least 3mm from the base of the expose bulb. Bending at the same point twice or even more should be avoided.    Please use proper tools to hold and bent the leads, do not use the base of the lead frame as a fulcrum during lead forming .Bending s tress to the base of the lead frame may cause character is tics change on LED or even break it.    Just for the same reason, when mounting the LED on to printed circuit board, the holes on the circuit board should be exactly aligned with the leads of the LED.   5. Soldering Be careful because damages always caused during soldering. Please note that stress to the leads and expose bulb should be avoided during soldering particularly when heated. When soldering, leave certain distance from soldering joint to base, the distance is determined by different soldering techniques.