Shenzhen LZ LED Technology Co., Ltd.
Shenzhen LZ LED Technology Co., Ltd.
60mA 5050smd 0.2w LED components
  • 60mA 5050smd 0.2w LED components
60mA 5050smd 0.2w LED components

60mA 5050smd 0.2w LED components

Delivery Time:
5 Days
Quantity:

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Basic Info
Basic Info
Place of Origin: Guangdong, China (Mainland)
Product Description
Product Description
5.5*5.0 TOP LED White Light Ultra Bright LED Lead (Pb) Free Product - RoHS Compliant LZ083XW16-03  

Features

• package: white PLCC-6package, colored diffused resin

• feature of the device: extremely wide viewing angle; long life time due to enhanced resin material

• color coordinates: x=0.3165, y=0. 3304 acc. to CIE 1931(while)

• typ. color temperature: 6500K

• viewing angle: Lambertian Emitter (120°)

• technology: InGaN

• grouping parameter: luminous intensity, color coordinates

• assembly methods: suitable for all SMT assembly methods

• soldering methods: IR reflow soldering and TTW soldering

• preconditioning: acc. to JEDEC Level 2

• taping: 12 mm tape with1000/reel, ø180 mm

• ESD-withstand voltage: ESD sensitive device

Applications

• outdoor displays

• backlighting (LCD, switches, keys, displays, illuminated advertising)

• interior and exterior automotive lighting

• substitution of micro incandescent lamps, reading lamps

• emergency lighting

• signal and symbol luminaire

• marker lights (e.g. steps, exit ways, etc.)

 

 

 

 

 

 

 

 

 

                                                    

    Ordering Information

Type

Color of Emission

Luminous Intensity(IF= 20mA×3)

Min IV (LM)

MAX IV (LM)

LZ083XW16-03

white

18

22

Note:

 

In order to ensure availability, single brightness groups will not be orderable.

 

 

 

In order to ensure availability, single chromaticity coordinate groups will not be orderable .

 

      Caution 1.  Recommended storage condition:  At 20℃~30℃ and relative humidity 70% RH max. 2.    After this bag is opened, devices that will be applied to infrared reflow, vapor-phase reflow, or equivalent soldering process must be: a.     Completed within 24hours. b.    Stored at less than 30% RH. 3.    Devices require baking before mounting, if: 2a or 2b is not met. 4.    If baking is required, devices must be baked under blow conditions: 12hours at 75℃±3℃.

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