Multilayer PCB Manufacturing Process FPC Board Flexible PCB

Multilayer PCB Manufacturing Process FPC Board Flexible PCB Immersion Gold Yellow

• Rigid-flex, flexible circuit
• 1-12 layers
• Width / space - 0,075mm single / double sided
• Hole (mini) - drill (pth) 0,15mm / punch 0,5mm
• Surface treatment - Ni / Au, ENIG, Tin plating
• Peel strenght - adhesive 1,0 mil - 1,0 kg f/cm IPC-TM 650 2.4.9

- adhesive 0,5 mil - 0,5 kg f/cm IPC-TM 650 2.4.9

• Solder float resistance - 270^oC / 10 sec
• Insulation resistance - 500 Mohm
• Dielectric withstanding voltage - 500 V