
Unlocked Option GTM380 7.2Mbps 3G WCDMA HSUPA HSDPA EDGE GRPS GPS WWAN Mini PCI-E Module
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Place of Origin: | Guangdong, China (Mainland) |
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Product Description
Product Description
Specifications Unlocked Option GTM380 7.2Mbps 3G WCDMA HSUPA HSDPA EDGE GRPS GPS WWAN Mini PCI-E Module
Unlocked Option GTM380 7.2Mbps 3G WCDMA HSUPA HSDPA EDGE GRPS GPS WWAN Mini PCI-E Module Features Global connectivity with tri-band 3G and quad-band 2G Multimode HSUPA / HSDPA / UMTS / EDGE / GPRS module Multimedia features of Qualcomm baseband chip Type 3 Advanced Receiver Technology allowing Receiver Diversity and Equalization at the same time High-speed data with HSPA (HSDPA / HSUPA) (up to 7.2 Mbps downlink and 2 Mbps uplink) and UMTS and backward compatible with EDGE / GPRS data connectivity (up to 247 Kbps) Transparent hand-over between UMTS and GPRS / EDGE networks Low power dissipation for easy embedding into devices Benefits from large Option experience in PC datacards Easy integration made possible thanks to: Testing on infrastructures and networks worldwide Flexible driver design providing both NDIS and modem modes for easy integration into dashboard applications Future proofing through Flash Memory technology Connectors for external antennas Specifications HSUPA / HSDPA / UMTS Multi-bands variants (bands with Rx diversity areunderlined) MO 0301: 850 / 1900 /2100(Rx diversity) MHz Power Class 3 (+24 dBm) HSUPA mode: 2 Mbps : category 5 HSDPA modes: HSDPA 1.8: Categories 1-4, 11 and 12 HSDPA 3.6: Categories 5 and 6 HSDPA 7.2: Category 7 and 8 Equalization and Rx Diversity at the same time UMTS: 384 Kbps operation in downlink, 384 Kbps in uplink Support UL and DL Compressed Modes Circuit-switched data: 64, 14.4 and 9.6 Kbps Hardware specifications Operating Temperature: -10 to +55â°C Extended Operating Temperature: -25 to +75â°C Storage Temperature: -40 to +85â°C Humidity: 5 to 95% no-condensing
Unlocked Option GTM380 7.2Mbps 3G WCDMA HSUPA HSDPA EDGE GRPS GPS WWAN Mini PCI-E Module Features Global connectivity with tri-band 3G and quad-band 2G Multimode HSUPA / HSDPA / UMTS / EDGE / GPRS module Multimedia features of Qualcomm baseband chip Type 3 Advanced Receiver Technology allowing Receiver Diversity and Equalization at the same time High-speed data with HSPA (HSDPA / HSUPA) (up to 7.2 Mbps downlink and 2 Mbps uplink) and UMTS and backward compatible with EDGE / GPRS data connectivity (up to 247 Kbps) Transparent hand-over between UMTS and GPRS / EDGE networks Low power dissipation for easy embedding into devices Benefits from large Option experience in PC datacards Easy integration made possible thanks to: Testing on infrastructures and networks worldwide Flexible driver design providing both NDIS and modem modes for easy integration into dashboard applications Future proofing through Flash Memory technology Connectors for external antennas Specifications HSUPA / HSDPA / UMTS Multi-bands variants (bands with Rx diversity areunderlined) MO 0301: 850 / 1900 /2100(Rx diversity) MHz Power Class 3 (+24 dBm) HSUPA mode: 2 Mbps : category 5 HSDPA modes: HSDPA 1.8: Categories 1-4, 11 and 12 HSDPA 3.6: Categories 5 and 6 HSDPA 7.2: Category 7 and 8 Equalization and Rx Diversity at the same time UMTS: 384 Kbps operation in downlink, 384 Kbps in uplink Support UL and DL Compressed Modes Circuit-switched data: 64, 14.4 and 9.6 Kbps Hardware specifications Operating Temperature: -10 to +55â°C Extended Operating Temperature: -25 to +75â°C Storage Temperature: -40 to +85â°C Humidity: 5 to 95% no-condensing
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