High quality Biwin mSATA ssd for thin client

  High quality Biwin mSATA ssd for thin client   Product Description          1.Product Specifications of mSATA SSD Solid State Drive
 

Product Code	M6320
Interface	SATAIII
Flash	TLC
Density	120GB/240GB
Max Transfer Performance (Varies by density)	Read: 564MB/s Write: 518MB/s
ECC	BCH ECC 72 bits/1KB
Operating Voltage	+3.3V(±5%)
Power Consumption  (Varies by density)	0.25W(idle) 2.94W(active)
Operating Temperature	0-70℃
Storage Temperature	-40-85℃
Humidity	5%-95%
MTBF	2,000,000 Hours
Shock	50(G),11(ms), half-sine wave
Vibration	3.1G(2-500Hz)
Dimension(mm)	50.8*29.85*4.85 mm
Weight(g)	≤10.00g

    2.Features 1. Zero Mechanical Interference 2. with reliable and real original MLC/SLC/TLC chips  3. High speed with multichannel. 4. Low power,without noise 5. without loss of data even if power off   Solid State Drive 
-Factory good quality & low price 
-Support for TRIM 
-Support S.M.A.R.T 
-accept small order   3.Product Pictures of mSATA SSD Solid State Drive         4.Application of Our Products       5.More Products for You to Choose         Company Information         6. Our Factory View       Our factory has full range of product line:
- PCI-E, 2.5”SATA, 2.5”PATA, 1.8”SATA, 1.8”PATA, Half Slim, NGFF, mSATA, mSATA Mini, SATA DOM, PATA DOM, USB DOM - Memory Card: CFast Card, CF Card;
- Embedded Chips: eMMC, eMCP;
Applicable to harsh operating temperature environments of industrial grade.   7.Trade Show     8.Certifications   Biwin has passed ISO 9001 ISO 14001 and been audited by SGS. All of our SSD products are RoHS directive-compliant and carry CE, FCC, RoHS approvals. We offer all the models with 3 years warranty.       Our Services      9. Our Services   Reliability Testing: - High and Low Temperature Storage
- High and Low Temperature Operation
- High and Low Temperature Cycling
- ESD Testing 
- Vibration and Shock Testing
- Room Temperature Aging Testing
- Power Failure Testing State-of-the-art Manufacturing:
- Quality Guaranteed Products
- Strict Quality Control Standards
- Short Lead Time
- Low Product Defect Rate
- Large production Capacity Wafer Packaging Service:
- First 12" Wafer Packaging Factory in South China
- Include IC Design, Packaging, Testing, Assembling
- Wafer Packaging Products:TSOP 48, QFN, QFP, BGA, LGA, eMMC, UDP.     10. Our Markets       11. Welcome to Contact Us