
Best Price High Quality 16GB 32GB EMMC V4.41
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- 3 Days
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Basic Info
Place of Origin: | Guangdong, China (Mainland) |
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Product Description
Product Description
Best Price High Quality 16GB 32GB EMMC V4.41 Product Description
1.Product Specifications of 32GB EMMC 1.NAND MLC flash,standard interface we own independent WAFER cutting, packaging and testing factory which is the 1st one in South of China. 2. Error correcting code, block management ,wear leveling command management supported. 3. Low power consumption Parameters quick view 
LFBGA 153-ball:11.5*13*1.0mm,4GB,8GB
LFBGA 169-ball:12*16*1.0mm,8GB,16GB,32GB 2.Product Pictures of 32GB EMMC


3.Application of Our Products
4.More Products for You to Choose
Company Information
5. Our Factory View
Our factory has full range of product line:
- PCI-E, 2.5”SATA, 2.5”PATA, 1.8”SATA, 1.8”PATA, Half Slim, NGFF, mSATA, mSATA Mini, SATA DOM, PATA DOM, USB DOM - Memory Card: CFast Card, CF Card;
- Embedded Chips: eMMC, eMCP;
Applicable to harsh operating temperature environments of industrial grade. 6.Trade Show
7.Certifications Biwin has passed ISO 9001 ISO 14001 and been audited by SGS. All of our SSD products are RoHS directive-compliant and carry CE, FCC, RoHS approvals. We offer all the models with 3 years warranty.
Our Services 8. Our Services Reliability Testing: - High and Low Temperature Storage
- High and Low Temperature Operation
- High and Low Temperature Cycling
- ESD Testing
- Vibration and Shock Testing
- Room Temperature Aging Testing
- Power Failure Testing State-of-the-art Manufacturing:
- Quality Guaranteed Products
- Strict Quality Control Standards
- Short Lead Time
- Low Product Defect Rate
- Large production Capacity Wafer Packaging Service:
- First 12" Wafer Packaging Factory in South China
- Include IC Design, Packaging, Testing, Assembling
- Wafer Packaging Products:TSOP 48, QFN, QFP, BGA, LGA, eMMC, UDP. 9. Our Markets
10. Welcome to Contact Us


LFBGA 153-ball:11.5*13*1.0mm,4GB,8GB
LFBGA 169-ball:12*16*1.0mm,8GB,16GB,32GB 2.Product Pictures of 32GB EMMC









- PCI-E, 2.5”SATA, 2.5”PATA, 1.8”SATA, 1.8”PATA, Half Slim, NGFF, mSATA, mSATA Mini, SATA DOM, PATA DOM, USB DOM - Memory Card: CFast Card, CF Card;
- Embedded Chips: eMMC, eMCP;
Applicable to harsh operating temperature environments of industrial grade. 6.Trade Show


- High and Low Temperature Operation
- High and Low Temperature Cycling
- ESD Testing
- Vibration and Shock Testing
- Room Temperature Aging Testing
- Power Failure Testing State-of-the-art Manufacturing:
- Quality Guaranteed Products
- Strict Quality Control Standards
- Short Lead Time
- Low Product Defect Rate
- Large production Capacity Wafer Packaging Service:
- First 12" Wafer Packaging Factory in South China
- Include IC Design, Packaging, Testing, Assembling
- Wafer Packaging Products:TSOP 48, QFN, QFP, BGA, LGA, eMMC, UDP. 9. Our Markets


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