BIWIN 1TB PCI-e Card PCI-e SSD E9900 for Enterprise Solution

Specifications *Compiles with PCI Express 3.0 specification

*High IOPS performance

*Support Intergrated RAID

  Product Description  

Product Code	E9900
Interface	PCI-E 3.0
Capacity	1TB	2TB	4TB
Controller	LSI 2308 + SM2245EN
[ATTO]Max Sequential Read	3,000 MB/s	3,000 MB/s	4,000 MB/s
[ATTO]Max Sequential Write	2,400 MB/s	2,800 MB/s	2,900 MB/s
Dimension L*W*H(mm)	195 x 96 x 18
Weight	≤185g
Flash Type	MLC
OS Compatibility	Windows 7;Windows Vista;Windows XP;Windows Server 2000;Windows Server 2003;Windows Server 2008;Windows Linux;
MTBF	2 million hours
Standard Operating Voltage	12V
Max Power Consumption	30W	40W	40W
Operating Temperature	0 to 70°C
Storage Temperature	-40 to 85°C
Humidity	5%-90%

 

      Company Information   About BIWIN Corporate Overview:   Founded as an electronic product manufacturer in Shenzhen, China 1995, BIWIN specializes in producing flash storage products, including solid state drives, Compact Flash cards and USB flash drives. With 18 years' industry expertise and a strong team with over 150 skilled engineers, BIWIN develops its leading edge flash storage products completely in-house, including Solution Designing, Wafer packaging, IC Testing, SMT and Assembling, Product Testing. Manufacturing is conducted according to strict quality standards to ensure consistently high quality products.     BIWIN Vision Statement:   BIWIN strives to become a leader in consumer electronic industry in the world.     BIWIN's Win-Win Philosophy:   BIWIN determines to be customer's best partner by understanding customers’needs and meeting their requirements. While customers enhance their core competitive ability, BIWIN perfects its services and becomes stronger. This is our Win-Win philosophy.     Full range of Product Line:   Including 2.5”SATA, 2.5”PATA, SATA DOM, PATA DOM, mSATA, CFast Card, CF Card, eMMC, eMCP, etc. Applicable to harsh operating temperature environments of industrial grade.           Reliability Testing:   -High and Low Temperature Storage
-High and Low Temperature Operation
-High and Low Temperature Cycling
-ESD Testing 
-Vibration and Shock Testing
-Room Temperature Aging Testing
-Power Failure Testing     Wafer Packaging Service:   -First 12" Wafer Packaging Factory in South China
-Include IC Design, Packaging, Testing, Assembling
-Wafer Packaging Products:TSOP 48, QFN, QFP, BGA, LGA, eMMC, UDP.