Service on PCB Assembly PCBA OEM

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Basic Info

Place of Origin:	Shenzhen, China
Payment Type:	T/T, Paypal, Western Union

Product Description

Specialize in Prototypes to large batch production
High technology 1~8 layers PCBA from 0.2~3.2mm thickness with 0.3~6.0oz copper thickness, conform to RoHS/UL, ISO9001: 2008 & ISO/TS16949: 2009, ISO14001: 2004
FR4, FR4(TG130, 150, 170), FR1, CEM-1, CEM3, Aluminum based, HF (Rogers, Teflon)
HDI and Sequential Lamination
Flexible, Flex-rigid and Rigid PCBs

PCBA Capabilities included
*Components procerement, PCB and accessories manufacturing, PCB Assembly, mechanical and final assembly, Electronic testing and function testing.

*High precision0402, 0603, 0805, 1210 and 2512; Fine pitch QFP(0.3mm), BGA(0.5mm), IC(0.3mm) bonding size components SMT technology and lead free RoHS technology.

*Circuit boards with 1 to 8 layers PCB layout, modification, fabrication, plastics, metal box building, final assembly and testing.

*ISO 9001-2000 certification and elevator safety report.

Package & Shipping Method:
1. Vacuum package with silica gel, Carton box with packing belt.
2. By DHL, UPS, FedEx, TNT
3. By EMS (Usually for Russia Clients)
4. By sea for mass quantity according to customer's requirement

Payment method
1. T/T
2. Paypal
3. Western Union

Files	Gerber, Protel, Powerpcb, Autocad, Orcad, etc
Material	FR-4, Hi-Tg FR-4, Lead free Materials (RoHS Compliant) , FR1, CEM-3, CEM-1, Aluminium, High frequency Material (Rogers, Teflon, Taconic), Polymide.
Layer No.	1 - 16 Layers
Board thickness	0.0075"(0.2mm)-0.125"(3.2mm)
Board Thickness Tolerance	±10%
Copper thickness	0.3OZ - 4OZ
Impedance Control	±10%
Warp and Twist	≤0.075%
Peel Strength	≥61B/in(≥107g/mm)
Min Trace Width (a)	3mil
Min Space Width (b)	3mil
Min Annular Ring	0.004"(0.1mm)
SMD Pitch (a)	0.012"(0.3mm)
pcb with green solder mask and LF-FREE surface finishing BGA Pitch (b)	0.027"(0.675mm)
Register tolerance	0.05mm
Min Solder Mask Dam (a)	0.005"(0.125mm)
Solder mask Clearance (b)	0.005"(0.125mm)
Min SMT Pad spacing (c)	0.004"(0.1mm)
Solder Mask Thickness	0.0007"(0.018mm)
Hole size	0.008"(0.20mm)-- 0.257"(6.5mm)
Hole Size Tol (+/-)	±0.003"(±0.0762mm)
Max PTH Aspect Ratio	10:1
Hole Registration	0.003"(0.075mm)
HASL	2.5um
Lead free HASL	2.5um
Immersion Gold	Nickel 3-7um Au:1-3u''
OSP	0.2-0.5um
Panel Outline Tol (+/-)	±0.004''(±0.1mm)
Beveling	30°45°
V-cut	15° 30° 45° 60°
Surface finish	HAL, HASL Lead Free, Immersion gold, Gold plating, Gold finger, immersion silver, immersion Tin, OSP, Carbon ink,
Certificate	ROHS ISO9001 TS16949 SGS UL
Special requirements	Buried&blind vias, Impedance control, via plug, BGA soldering and gold finger

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