
Medical Use Flexible PCB and FPC
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Basic Info
Place of Origin: | Shenzhen, China |
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Payment Type: | T/T, Paypal, Western Union |
Product Description
Product Description
High technology 1~16layers PCBs from 0.2~3.2mm thickness with 0.3~4.0oz copper thickness
FR4, FR4(TG130,150,170), FR1,CEM-1, CEM3, Aluminum based, HF (Rogers,Teflon)
HDI and Sequential Lamination
Flexible, Flex-rigid and Rigid PCBs
RoHS/UL, ISO9001:2008 & ISO/TS16949:2009, ISO14001:2004
What will you get from FZ-PCB
Reliable and stable quality with more than 12 years pcb manufacturing experience.
Quick response & 24 hours available service.
Professional sales service & advice.
Fulfillment of our promises, NO lies.
Protecting your Intellectual property. All our staff of trained professionals are working under a strict confidential contract.
Package & Shipping Method:
1. Vacuum package with silica gel, Carton box with packing belt.
2. By DHL, UPS, FedEx, TNT
3. By EMS (Usually for Russia Clients)
4. By sea for mass quantity according to customer's requirement
Factory glance
FR4, FR4(TG130,150,170), FR1,CEM-1, CEM3, Aluminum based, HF (Rogers,Teflon)
HDI and Sequential Lamination
Flexible, Flex-rigid and Rigid PCBs
RoHS/UL, ISO9001:2008 & ISO/TS16949:2009, ISO14001:2004
What will you get from FZ-PCB
Reliable and stable quality with more than 12 years pcb manufacturing experience.
Quick response & 24 hours available service.
Professional sales service & advice.
Fulfillment of our promises, NO lies.
Protecting your Intellectual property. All our staff of trained professionals are working under a strict confidential contract.
Package & Shipping Method:
1. Vacuum package with silica gel, Carton box with packing belt.
2. By DHL, UPS, FedEx, TNT
3. By EMS (Usually for Russia Clients)
4. By sea for mass quantity according to customer's requirement
Factory glance
Files | Gerber, Protel, Powerpcb, Autocad, Orcad, etc |
Material | FR-4, Hi-Tg FR-4, Lead free Materials (RoHS Compliant) , FR1, CEM-3, CEM-1, Aluminium, High frequency Material (Rogers, Teflon, Taconic), Polymide. |
Layer No. | 1 - 16 Layers |
Board thickness | 0.0075"(0.2mm)-0.125"(3.2mm) |
Board Thickness Tolerance | ±10% |
Copper thickness | 0.3OZ - 4OZ |
Impedance Control | ±10% |
Warp and Twist | ≤0.075% |
Peel Strength | ≥61B/in(≥107g/mm) |
Min Trace Width (a) | 3mil |
Min Space Width (b) | 3mil |
Min Annular Ring | 0.004"(0.1mm) |
SMD Pitch (a) | 0.012"(0.3mm) |
pcb with green solder mask and LF-FREE surface finishing BGA Pitch (b) | 0.027"(0.675mm) |
Register tolerance | 0.05mm |
Min Solder Mask Dam (a) | 0.005"(0.125mm) |
Solder mask Clearance (b) | 0.005"(0.125mm) |
Min SMT Pad spacing (c) | 0.004"(0.1mm) |
Solder Mask Thickness | 0.0007"(0.018mm) |
Hole size | 0.008"(0.20mm)-- 0.257"(6.5mm) |
Hole Size Tol (+/-) | ±0.003"(±0.0762mm) |
Max PTH Aspect Ratio | 10:1 |
Hole Registration | 0.003"(0.075mm) |
HASL | 2.5um |
Lead free HASL | 2.5um |
Immersion Gold | Nickel 3-7um Au:1-3u'' |
OSP | 0.2-0.5um |
Panel Outline Tol (+/-) | ±0.004''(±0.1mm) |
Beveling | 30°45° |
V-cut | 15° 30° 45° 60° |
Surface finish | HAL, HASL Lead Free, Immersion gold, Gold plating, Gold finger, immersion silver, immersion Tin, OSP, Carbon ink, |
Certificate | ROHS ISO9001 TS16949 SGS UL |
Special requirements | Buried&blind vias, Impedance control, via plug, BGA soldering and gold finger |
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