FZ-PCB TECHNOLOGY CO., LIMITED
FZ-PCB TECHNOLOGY CO., LIMITED
Cem-1 Circuit Board LED PCB
  • Cem-1 Circuit Board LED PCB
Cem-1 Circuit Board LED PCB

Cem-1 Circuit Board LED PCB

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Basic Info
Basic Info
Place of Origin: Shenzhen, China
Payment Type: T/T, Paypal, Western Union
Product Description
Product Description
Specialize in CEM-1 LED PCB with competitive price in LED PCB line
High technology 1~16layers PCBs from 0.2~3.2mm thickness with 0.3~6.0oz copper thickness
 FR4, FR4(TG130,150,170), FR1,CEM-1, CEM3, Aluminum based, HF (Rogers,Teflon)
RoHS/UL, ISO9001:2008 & ISO14001/TS16949:2009

Package & Shipping Method:
1. Vacuum package with silica gel, Carton box with packing belt.
2. By DHL, UPS, FedEx, TNT
3. By EMS (Usually for Russia Clients)
4. By sea for mass quantity according to customer's requirement
 
Factory glance

Cem-1 Circuit Board LED PCB
Files Gerber, Protel, Powerpcb, Autocad, Orcad, etc
Material FR-4, Hi-Tg FR-4, Lead free Materials (RoHS Compliant) , FR1, CEM-3, CEM-1, Aluminium, High frequency Material (Rogers, Teflon, Taconic), Polymide.
Layer No. 1 - 16 Layers
Board thickness 0.0075"(0.2mm)-0.125"(3.2mm) 
Board Thickness Tolerance ±10%
Copper thickness 0.3OZ - 4OZ
Impedance Control ±10%
Warp and Twist ≤0.075%
Peel Strength ≥61B/in(≥107g/mm)
Min Trace Width (a) 3mil
Min Space Width (b) 3mil
Min Annular Ring 0.004"(0.1mm)
SMD Pitch (a) 0.012"(0.3mm)
pcb with green solder mask and LF-FREE surface finishing BGA Pitch (b) 0.027"(0.675mm)
Register tolerance 0.05mm
Min Solder Mask Dam (a) 0.005"(0.125mm)
Solder mask Clearance (b) 0.005"(0.125mm)
Min SMT Pad spacing (c) 0.004"(0.1mm)
Solder Mask Thickness 0.0007"(0.018mm)
Hole size 0.008"(0.20mm)-- 0.257"(6.5mm)
Hole Size Tol (+/-) ±0.003"(±0.0762mm)
Max PTH Aspect Ratio 10:1
Hole Registration 0.003"(0.075mm)
HASL 2.5um
Lead free HASL 2.5um
Immersion Gold Nickel  3-7um  Au:1-3u''
OSP 0.2-0.5um
Panel Outline Tol (+/-) ±0.004''(±0.1mm)
Beveling 30°45°
V-cut 15° 30° 45° 60°
Surface finish HAL, HASL Lead Free, Immersion gold, Gold plating, Gold finger, immersion silver, immersion Tin, OSP, Carbon ink,
Certificate  ROHS  ISO9001 TS16949  SGS  UL
Special requirements Buried&blind vias, Impedance control, via plug, BGA soldering and gold finger

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